Tatsuoki Kono
Toshiba
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Publication
Featured researches published by Tatsuoki Kono.
Electrochemical and Solid State Letters | 2009
Toshihide Takahashi; Shuichi Komatsu; Tatsuoki Kono
Pb-based solders are used as high temperature solders in power semiconductor devices. Although use of Pb is globally restricted, alternative materials are inadequate to replace Pb-based solder. This study aims to replace Pb-based solder with an intermetallic compound (IMC). Samples were produced to join a Si chip with evaporated Ag and Sn films onto a Ag-plated Cu substrate at 523 K for 10 s. As a result, the evaporated films were completely transformed into a Ag 3 Sn IMC. The IMC joint showed higher strength until 543 K and good heat-aging resistance at 423 K. Therefore, this joint would be promising in replacing Pb-based solders.
Archive | 1998
Hirotaka Hayashida; Hiroshi Kitayama; Masaaki Yamamoto; Shusuke Inada; Isao Sakai; Tatsuoki Kono; Hideki Yoshida; Takamichi Inaba; Motoya Kanda
Archive | 2002
Takao Sawa; Toshiya Sakamoto; Tatsuoki Kono; Norio Takami; Shinsuke Matsuno
Archive | 1999
Tatsuoki Kono; Isao Sakai; Hideki Yoshida; Takamichi Inaba; Masaaki Yamamoto; Shiro Takeno
Archive | 2006
Shinsuke Matsuno; Tatsuoki Kono; Norio Takami; Takao Sawa
Archive | 2001
Hirotaka Hayashida; Masaaki Yamamoto; Hiroshi Kitayama; Shusuke Inada; Isao Sakai; Tatsuoki Kono; Hideki Yoshida; Takamichi Inaba; Motoya Kanda
Archive | 2009
Shinetsu Fujieda; Katsuhisa Homma; Akiko Suzuki; Tatsuoki Kono
Archive | 2013
Toshihide Takahashi; Tatsuoki Kono; Mitsuhiro Oki; Akiko Suzuki
Archive | 2009
Shinetsu Fujieda; Tatsuoki Kono; Shinji Murai; Taro Fukaya; Hideyuki Tsuji; Akiko Suzuki; Nobuyuki Ashikaga
Archive | 2008
Nobuyuki Ashikaga; Shinetsu Fujieda; Taro Fukaya; Tatsuoki Kono; Shinji Murai; Akiko Suzuki; Hideyuki Tsuji
