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Dive into the research topics where Tatsuya Kubozono is active.

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Proceedings of SPIE, the International Society for Optical Engineering | 1996

New process for resist removal after lithography process using adhesive tape

Tatsuya Kubozono; Yutaka Moroishi; Yoshio Ohta; Hideaki Shimodan; Noboru Moriuchi

A novel concept for the resist removal after the photolithography in the wafer process is introduced. This new process is to peel off the resist layer with a special adhesive tape. A very little contamination on wafers is confirmed. Especially the metal contamination with this new process is very little compared with conventional O2 plasma ashing. Therefore the electrical properties of oxide layer and substrate are significantly improved. This new process should be very effective for the production of front-edge devices because of this improvement. In this paper, along with these observations, the mechanism of the removal is discussed. The monomer in the adhesive layer migrates into the resist layer and the two layers consolidated together. Very fine microanalysis technique to detect this phenomenon in situ is also explained.


Archive | 1999

Ultraviolet curing pressure-sensitive adhesive sheet

Shouji Yamamoto; Yoshio Nakagawa; Tatsuya Kubozono; Kouji Akazawa; Kouichi Hashimoto; Takahiro Fukuoka


Archive | 1999

Semiconductor wafer protection tacky sheet and grinding method of semiconductor wafer

Mitsuharu Akazawa; Takahiro Fukuoka; Koichi Hashimoto; Tatsuya Kubozono; Yoshio Nakagawa; 善夫 中川; 達也 久保園; 浩一 橋本; 孝博 福岡; 光治 赤沢


Archive | 2001

Re-release adhesive and re-release adhesive sheet

Kouichi Hashimoto; Takahiro Fukuoka; Koji Akazawa; Yoshio Nakagawa; Tatsuya Kubozono


Archive | 1996

Method for resist removal, and adhesive or adhesive sheet for use in the same

Takayuki Yamamoto; Tatsuya Kubozono; Yasuo Kihara; Yuji Okawa; Koichi Hashimoto; Takeshi Matsumura; Tatsuya Sekido; Masayuki Yamamoto; Chiaki Harada


Archive | 1999

Ultraviolet curable adhesive sheet

Mitsuharu Akazawa; Takahiro Fukuoka; Koichi Hashimoto; Tatsuya Kubozono; Yoshio Nakagawa; Masashi Yamamoto; 善夫 中川; 達也 久保園; 昌司 山本; 浩一 橋本; 孝博 福岡; 光治 赤沢


Archive | 1998

Semiconductor wafer with protective sheet attached thereto and grinding method of semiconductor wafer

Mitsuharu Akazawa; Tatsuya Kubozono; Yoshio Nakagawa; 義夫 中川; 達也 久保園; 光治 赤沢


Archive | 2000

Re-releasing type pressure-sensitive adhesive and re- releasing type pressure-sensitive adhesive sheet

Mitsuharu Akazawa; Takahiro Fukuoka; Koichi Hashimoto; Tatsuya Kubozono; Yoshio Nakagawa; 善夫 中川; 達也 久保園; 浩一 橋本; 孝博 福岡; 光治 赤沢


Archive | 1999

SEMICONDUCTOR WAFER PROTECTIVE ADHESIVE SHEET, AND GRINDING METHOD OF SEMICONDUCTOR WAFER

Mitsuharu Akazawa; Takahiro Fukuoka; Koichi Hashimoto; Tatsuya Kubozono; Yoshio Nakagawa; 善夫 中川; 達也 久保園; 浩一 橋本; 孝博 福岡; 光治 赤沢


Archive | 1996

Method of removing resist, and adhesive or adhesive sheet used for the method

Takayuki Yamamoto; Tatsuya Kubozono; Yasuo Kihara; Yuji Okawa; Koichi Hashimoto; Takeshi Matsumura; Tatsuya Sekido; Masayuki Yamamoto; Chiaki Harada

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