Teiichi Inada

The M-Designer: Proficient skilled material design software

In recent year, high computer performance is required and also highly performed and downsized semiconductors are required. Multi-layered semiconductor is one of the most important technologies to enhance its performance. To bond between each layer of multi-chip package, die-bonding film is known as an effective material instead of general boding material. In this respect, we had developed a novel low-modulus die-bonding adhesive film. Properties of the films are widely changed by the ratio of epoxy resin and acrylic polymer contents. To optimize the properties of the die-bonding films, the influence of various parameters on material properties was examined. However, since die-bonding film needs multiple features, it is not so easy for researchers to discover and develop the useful characteristics. In the strategy of development, new materials should develop at a low cost and for a brief period. To solve the problem, this paper proposes the weak conditioned combinatorial linear programming method (WCCLP). By defining solution area as a function of combination index, optimum epoxy resin content, acrylic polymer content is acquired. This optimization can be done by newly developed user-friendly software. Effectiveness of the proposed method is shown with basic analyses and the result of experiments. The software is applicable not only to semiconductor related materials but also to any formulation such as paint, medicine, food.

The Effect of 3rd Component on the Melt Rheology of Polymer Blend System

Uniaxial elongational flow behavior of polymer blend system containing three components (acrylic polymer, epoxy resin and SiO2) was investigated. The strain softening was observed at 80 °C and the strain hardening was observed at 60 °C for the same sample. We found that these non‐linear properties in uniaxial elongational flow behavior can be varied by temperature change for polymer blend containing three components.