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Teppei Ito

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Publication

Featured researches published by Teppei Ito.

Archive | 2010

METHOD FOR ELECTROLESS NICKEL-PALLADIUM-GOLD PLATING, PLATED PRODUCT, PRINTED WIRING BOARD, INTERPOSER AND SEMICONDUCTOR APPARATUS

Kenya Tachibana; Teppei Ito; Yasuaki Mitsui

Archive | 2011

METHOD FOR MANUFACTURING BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, PRINTED WIRING BOARD, INTERPOSER, AND SEMICONDUCTOR DEVICE

Kenya Tachibana; Teppei Ito; Yasuaki Mitsui

Archive | 2009

Electroless copper plating method, printed wiring board, method for manufacturing printed wiring board and semiconductor device

Ryoichi Okada; 岡田 亮一; Teppei Ito; 哲平 伊藤

Archive | 2010

METHOD OF MANUFACTURING SUBSTRATE WITH GOLD-PLATING METAL FINE PATTERN, SUBSTRATE WITH GOLD-PLATING METAL FINE PATTERN, PRINTED WIRING BOARD, INTERPOSER, AND SEMICONDUCTOR DEVICE

Teppei Ito; Yasuaki Mitsui; Kenya Tachibana; 保明 三井; 哲平 伊藤; 賢也 橘

Archive | 2009

ELECTROLESS COPPER PLATING METHOD, PRINTED WIRING BOARD, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE

Ryoichi Okada; Teppei Ito

Archive | 2006

Vehicle seat and method of assembly

Teppei Ito; Misao Omori; 哲平 伊藤; 操 大森

Archive | 2013

Laminated board, and method for manufacturing printed wiring board

Teppei Ito; 哲平 伊藤; Noriyuki Daito; 範行 大東

Archive | 2012

基板、金属膜、基板の製造方法および金属膜の製造方法

Teppei Ito; 哲平 伊藤

Archive | 2011

金メッキ金属微細パターン付き基材の製造方法、金メッキ金属微細パターン付き基材、プリント配線板、インターポーザ及び半導体装置

Kenya Tachibana; 賢也 橘; Teppei Ito; 哲平 伊藤; Yasuaki Mitsui; 保明 三井

Archive | 2011

Procédé de fabrication d'une matière de base comportant un motif fin métallique plaqué or, matière de base comportant un motif fin métallique plaqué or, carte de circuit imprimé, interposeur et dispositif semi-conducteur

Kenya Tachibana; 賢也 橘; Teppei Ito; 哲平 伊藤; Yasuaki Mitsui; 保明 三井

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Nobuki Tanaka

Kawasaki Steel Corporation

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