Teresa B. Peters

Design of an Integrated Loop Heat Pipe Air-Cooled Heat Exchanger for High Performance Electronics

The continually increasing heat generation rates in high performance electronics, radar systems and data centers require development of efficient heat exchangers that can transfer large heat loads. In this paper, we present the design of a new high-performance heat exchanger capable of transferring 1000 W while consuming less than 33 W of input electrical power and having an overall thermal resistance of 0.05 K/W. The low thermal resistance is achieved by using a loop heat pipe with a single evaporator and multiple condenser plates that constitute the array of fins. Impellers between the fins are driven by a custom permanent magnet synchronous motor in a compact volume of 0.1 × 0.1 × 0.1 m to maximize the heat transfer area and reduce the required airflow rate and electrical power. The design of the heat exchanger is developed using analytical and numerical methods to determine the important parameters of each component. The results form the basis for the fabrication and experimental characterization that is currently under development.

Design and analysis of high-performance air-cooled heat exchanger with an integrated capillary-pumped loop heat pipe

We report the design and analysis of a high-power air-cooled heat exchanger capable of dissipating over 1000 W with 33 W of input electrical power and an overall thermal resistance of less than 0.05 K/W. The novelty of the design combines the blower and heat sink into an integrated compact unit (4″ × 4″ × 4″) to maximize the heat transfer area and reduce the required airflow rates and power. The device consists of multiple impeller blades interdigitated with parallel-plate condensers of a capillary-pumped loop heat pipe. The impellers are supported on a common shaft and powered with a low-profile permanent magnet synchronous motor, while a single flat-plate evaporator is connected to the heat load.

Investigation of a Multiple Impeller Design for a High Performance Air-Cooled Heat Sink

A high-performance air-cooled heat sink that incorporates a novel heat pipe with multiple parallel condenser layers and interdigitated blower impellers is presented. A flow circuit model was developed in order to predict the air flow performance of a 15-layer impeller system using experimental measurements from a single layer. A 15-layer impeller system was constructed to validate the flow circuit model. The performance of the multi-layer system was investigated by using a hot wire anemometer to compare flow between layers and by measuring the inflation rate of a bag enclosing the air outlets. This work addresses important issues that allow the extension of the air flow modeling and experimental results from a single impeller design to a multilayer stack of impellers operating in parallel and sharing a common inlet.Copyright

Development and Characterization of a Loop Heat Pipe With a Planar Evaporator and Condenser

We present the development and characterization of an air-cooled loop heat pipe with a planar evaporator and condenser. The condenser is mounted vertically above the evaporator, and impellers are integrated both sides of the condenser with tight clearance. The planar geometry allows for effective convective cooling by increasing the surface area and the convective heat transfer coefficient. To ensure condensation across the area of the condenser, a wicking structure is integrated in the condenser. The evaporator incorporates a multi-layer wicking structure to maintain a thermal gradient between the vapor and liquid regions, which is used to sustain the vapor and liquid pressures necessary for operation. The loop heat pipe was demonstrated to remove 140 W of heat at a temperature difference between the evaporator base and inlet air of 50 °C. This work is the first step towards the development of an air-cooled, multiple-condenser loop heat pipe.Copyright

Development of a compensation chamber for use in a multiple condenser loop heat pipe

We report the design and analysis of a novel compensation chamber for use in PHUMP, a multiple condenser loop heat pipe (LHP) capable of dissipating 1000 W. The LHP is designed for integration into a high performance air-cooled heat sink to address thermal management challenges in advanced electronic systems. The compensation chamber is integrated into the evaporator of the device and provides a region for volumetric expansion of the working fluid over a range of operating temperatures. Additionally, the compensation chamber serves to set the liquid side pressure of the device, preventing both flooding of the condensers and dry out of the evaporator. The compensation chamber design was achieved through a combination of computational simulation using COMSOL Multiphysics and models developed based on experimental work of previous designs. The compensation chamber was fabricated as part of the evaporator using Copper and Monel sintered wicks with various particle sizes to achieve the desired operating characteristics. Currently, the compensation chamber is being incorporated into a multiple condenser LHP for a high performance air-cooled heat sink.Copyright

Integration of a Multiple-Condenser Loop Heat Pipe in a Compact Air-Cooled Heat Sink

We present the characterization of a compact, high performance air-cooled heat sink with an integrated loop heat pipe. In this configuration, heat enters the heat sink at the evaporator base and is transferred within the heat pipe by the latent heat of vaporization of a working fluid. From the condensers, the heat is transferred to the ambient air by an integrated fan. Multiple condensers are used to increase the surface area available for air-cooling, and to ensure the equal and optimal operation of the individual condensers, an additional wick is incorporated into the condensers. We demonstrated with this design (10.2 cm × 10.2 cm × 9 cm), a total thermal resistance of less than 0.1 °C/W while dissipating a heat load of 500 W from a source at 75 °C. Furthermore, constant thermal resistance was observed in the upright as well as sideways orientations. This prototype is a proof-of-concept demonstration of a high performance and efficient air-cooled heat sink design that can be readily integrated for various electronics packaging and data center applications.© 2013 ASME

Scaling the performance of an air-cooled loop heat pipe with the addition of modular condensers

We report the performance of a novel air-cooled loop heat pipe with a planar condenser and planar evaporator, and the performance improvement expected from a multiple-condenser version of the device. The condensers are developed in a modular design, and the heat pipe is configured to allow the installation of multiple, stacked condensers. An analytical model is developed to predict the scaling of convective thermal resistance with the addition of condensers. The result of the model is compared with the thermal resistance measured from a single-condenser prototype (0.18-0.23°C/W), and the effect of condenser count on thermal resistance is discussed. The heat pipe is intended for the integration into a high-performance air-cooled heat sink.

Characterization of a Condenser for a High Performance Multi-Condenser Loop Heat Pipe

We experimentally characterized a condenser design for a multi-condenser loop heat pipe (LHP) capable of dissipating 1000 W. The LHP is designed for integration into a high performance air-cooled heat sink to address thermal management challenges in advanced electronic systems. The multi-layer stack of condensers utilizes a sintered wick design to stabilize the liquid-vapor interface and prevent liquid flooding of the lower condenser layers in the presence of a gravitational head. In addition a liquid subcooler is incorporated to suppress vapor flashing in the liquid return line. We fabricated the condensers using photo-chemically etched Monel frames with Monel sintered wicks with particle sizes up to 44 μm. We characterized the performance of the condensers in a custom experimental flow rig that monitors the pressure and temperatures of the vapor and liquid. The condenser dissipated the required heat load with a subcooling of up to 18°C, while maintaining a stable liquid-vapor interface with a capillary pressure of 6.2 kPa. In the future, we will incorporate the condenser into a loop heat pipe for a high performance air-cooled heat sink.Copyright