Terutake Hayashi

The Spark Plasma Sintering Method Using Laminated Titanium Powder Sheet for Fabricating Porous Biocompatible Implants

☆Rate of shrinkage ・46-52 % (Total of SPS process) ・5-11 % (By sintering) ☆Rate of expansion ・4.7-5.0 % (φ14.31±0.02→φ15 mm) ・Sintering temperature-independent ☆Porosity ・14 % (Sintering temperature: 650°C) ・8 % (Sintering temperature: 700°C) The proposed method is a combined technology of SPS with rapid prototyping or layered manufacturing. A sheet of titanium powder is formed as thick as about 150 μm by the mask printing method. The sheet is processed to form a two-dimensional shape by laser cutting, and then laminated to build a threedimensional object. Finally, a stack of the titanium layers is packed into a carbon mold and sintered by the SPS process. Implant shape by rapid prototyping Pore structure by spark plasma sintering

Fluxless Laser Soldering of Antenna Wires for Noncontact IC Cards

The development of noncontact IC cards is in a rapid progress toward their practical use. A process of connecting an IC chip with antenna wires poses problems from viewpoints of mass productivity and antenna characteristics. The present paper proposes a method of laser soldering of antenna wires for noncontact IC cards : fluxless laser soldering that consists of heating a copper wire with an Nd : YAG laser beam and pressing it onto the chip and solder bump successively. Comparing with the conventional pulse heat method, some advantages are confirmed : shorter soldering time and maintenance-free operation. The soldered part shows a good wettability and a sufficient tensile strength of 3.64MPa.