Tetsuo Ohkubo

Resin composition and solder resist composition

Photo-imaging resist ink and cured product thereof

Novel silicone-urethane (meth) acrylate, and resin composition and coating material comprising same

Resist ink composition and cured article prepared therefrom

Di-(meth)acrylic acid ester, resin composition comprising the same and coating agent comprising the same

Novel (meth)acrylate and resin composition comprising the same

Diesters of (meth)acrylic acid and resin compositions comprising the same

Novel silicone-urethane (meth) acrylate, and resin componovel silicone-urethane (meth) acrylate, and resin composition and coating material comprising same sition and coating material comprising same

Unsaturated group-containing polycarboxlic acid resin, resin composition and solder resist resin composition comprising the same and cured product thereof

Phosphates having one to three (meth)acrylate groups