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Tetsuo Okuyama

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Publication

Featured researches published by Tetsuo Okuyama.

Archive | 1999

GRINDING TOOL AND POLISHING METHOD USING IT

Koji Fukuda; Shiro Murai; Tetsuo Okuyama; 哲雄 奥山; 史朗 村井; 紘二 福田

Archive | 1999

Ingot slicing method, an ingot manufacturing method and a sliced ingot grinding apparatus

Kenichiro Nishi; Tetsuo Okuyama; Mitsuru Nukui; Kazuo Nakajima; Shirou Murai; Tomio Nakagawa

Archive | 2000

Method for manufacturing solar battery

Tetsuo Okuyama; Teiichi Tsubata; 哲雄 奥山; 禎一 津幡

Archive | 2000

Vacuum holding device for wafer conveying system and method of releasing vacuum holding condition

Shiro Murai; Tetsuo Okuyama; 哲雄 奥山; 史朗 村井

Archive | 2003

GRINDING METHOD AND APPARATUS FOR EDGE OF SEMICONDUCTOR DEVICE

Shiro Murai; Tetsuo Okuyama; 哲雄 奥山; 史朗 村井

Archive | 2002

Coolant injection device of semiconductor wafer grinding machine, and method therefor

Tomoyuki Kawazu; Shiro Murai; Tetsuo Okuyama; Kunihiro Saida; 奥山 哲雄; 斎田 国広; 村井 史朗; 河津 知之

Archive | 2000

Grinding work method for semiconductor wafer and grinding auxiliary device

Koji Fukuda; Tomoyuki Kawazu; Shiro Murai; Tetsuo Okuyama; 哲雄 奥山; 史朗 村井; 知之 河津; 紘二 福田

Archive | 1998

Cracking occurrance predicting method of workpiece, wafer working method utilizing the same, and grinder

Shiro Murai; Kenichiro Nishi; Mitsuru Nukui; Tetsuo Okuyama; 哲雄 奥山; 史朗 村井; 満 温井; 健一朗 西

Archive | 1999

MANUFACTURE OF GRINDING TOOL AND POLISHING METHOD

Koji Fukuda; Shiro Murai; Tetsuo Okuyama; 哲雄 奥山; 史朗 村井; 紘二 福田

Archive | 2000

Grinding spindle with dual tool mounting means

Tomoyuki Kawatsu; Shirou Murai; Tetsuo Okuyama; Kunihiro Saita

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Yasuhiro Tani

Ritsumeikan University

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Yasuyuki Kamimura

University of Tokyo

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