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Archive | 1989

Energy Gap Measurement Made on “Clean” and Oriented YBa2Cu3O7-δ Surfaces

Jaw-Shen Tsai; I. Takeuchi; Jun-ichi Fujita; Tsutomu Yoshitake; Tetsuro Sato; Shinichi Tanaka; Takahito Terashima; Yoshichika Bando; Kenji Iijima; Kazunuki Yamamoto

Superconductive energy gap of YBa2Cu3O7-δ is measured in a novel broken film edge junction. (001), (103) and (110) oriented films are broken in a cryogenic environment along the appropriate directions together with the SrTiO3 substrate. Pb electrode is brought close in situ to the clean broken film edge. The normalized energy gap 2Δ(0)/kBTc measured in the direction along and perpendicular to the Cu-O plane are found to be 5.9±0.2 and 3.6±0.2 respectively. These values are independent of the variation in the values of Tc within the examined range of 40K~90K. The gap difference structure at ΔYBCO-Δpb is observed which help identifying the value of energy gap of the oxide superconductor unambiguously. Identification of the gap energies in BiSrCaCuO system by the same technique was attempted.


Archive | 1999

Resin-coated composite foil, production and use thereof

Tetsuro Sato; Tsutomu Asai; Kenichiro Iwakiri


Archive | 2007

Surface-treated copper foil, surface-treated copper foil with very thin primer resin layer, method for manufacturing the surface-treated copper foil, and method for manufacturing the surface-treated copper foil with very thin primer resin layer

Tetsuhiro Matsunaga; Toshifumi Matsushima; Tetsuro Sato


Archive | 2004

Copper foil with very thin adhesive layer and its production method

Toshifumi Matsushima; Tetsuro Sato; 哲朗 佐藤; 敏文 松島


Archive | 1999

Resin applied composite foil, production thereof, multilayered copper clad laminated sheet using composite foil and production of multilayered printed wiring board

Tsutomu Asai; Kenichiro Iwakiri; Tetsuro Sato


Archive | 2008

Resin composition and copper foil with resin obtained by using the resin composition

Tetsuro Sato; Toshifumi Matsushima; Tetsuhiro Matsunaga


Archive | 1997

Resin composition for copper-clad laminate, copper foil with resin, multilayer copper-clad laminate and multilayer printed circuit board

Tsutomu Asai; Tetsuro Sato; 哲朗 佐藤; 務 浅井


Archive | 2000

Resin compound for composing insulating interlayer of print circuit board, resin sheet for forming insulating layer using the resin compound and copper-plated laminate using them

Tsutomu Asai; Tetsuro Sato; 哲朗 佐藤; 務 浅井


Archive | 2008

Resin composition for forming insulating layer of printed wiring board

Tetsuro Sato; Toshifumi Matsushima


Archive | 2008

Copper foil with resin and process for producing copper foil with resin

Tetsuro Sato; Toshifumi Matsushima

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