Tetsuro Washida

Module mounted with semiconductor device

IC card with a discharge pattern and a ground pattern separated from each other

Non-contact IC card communicating at multiple frequencies

Terminal configuration in semiconductor IC device

Semiconductor device with a package having a plurality of bump electrodes and module with a plurality of semiconductor devices

Memory module with obstacle removing terminal structure

Bendable circuit board having improved resistance to bending strain and increased element mounting area

IC card and method of making the same

Semiconductor module having multiple circuit boards

IC card including a substrate having improved strength and heat radiation properties