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Featured researches published by Thj Bisschops.


Plasma Chemistry and Plasma Processing | 1991

Measurement of electron densities by a microwave cavity method in 13.56-MHz RF plasmas of Ar, CF4, C2F6, and CHF3

M Marco Haverlag; Gmw Gerrit Kroesen; Thj Bisschops; de Fj Frits Hoog

Electron densit ies have been determined /or RF plasmas that were generated within a microwave resonant cavity by measuring the difference of the resonance frequencies with and without plasma. Since that method only yields a value of the electron density weighted ouer the microwave electric field distribution, to obtain real values an assumption on the spatial distribution of the electron density had to he made. Spatial profiles were taken of the emission of a 4s–5p Ar line at 419.8 not (with a small Ar admixture). The electron densities have been determined as a function of pressure and RF power in Ar, CF4, C2 F6 and CHF, plasmas. The results indicate that the electron density for the last three gases decreases as a function of pressure above 50 m Torr. Typical values for the electron density for the investigated parameter range are 1–6 · 103 cm−3. Furthermore, the electron density is the lowest in gases with a high attachment cross .section.


Journal of Vacuum Science & Technology B | 1989

In situ ellipsometry during plasma etching of SiO2 films on Si

M Marco Haverlag; Gmw Gerrit Kroesen; de Cjh Zeeuw; Ylm Yves Creyghton; Thj Bisschops; de Fj Frits Hoog

The etching of SiO2 films on a Si substrate in an rf plasma in CF4 has been studied with i n s i t uellipsometry. The etch rate was measured as a function of flow, rf power and pressure. An accurate analysis of the experimental data using numerical simulations based on multilayermodels has yielded information both on the refractive index of the etched SiO2 film and on the existence of a top layer. It could be established that a layer is present on top of the SiO2 during etching, which is probably caused by roughening of the SiO2 layer. Furthermore at high pressures (>8 Pa) it was demonstrated that after the complete removal of the SiO2 film a polymer layer starts growing on the Si substrate.


Plasma Physics and Controlled Fusion | 1987

Plasma surface modification and plasma chemistry

Dc Daan Schram; Thj Bisschops; Gmw Gerrit Kroesen; de Fj Frits Hoog

• A submitted manuscript is the authors version of the article upon submission and before peer-review. There can be important differences between the submitted version and the official published version of record. People interested in the research are advised to contact the author for the final version of the publication, or visit the DOI to the publishers website. • The final author version and the galley proof are versions of the publication after peer review. • The final published version features the final layout of the paper including the volume, issue and page numbers.


Measurement Science and Technology | 1991

Spatially resolved high resolution interferometry

Gmw Gerrit Kroesen; Thj Bisschops; Rene Sanders; Aw Jansen; Dc Daan Schram; de Fj Frits Hoog

The construction of a cheap but very stable and accurate Michelson interferometer is described. To avoid (expensive) lock-in techniques a DC feedback loop has been implemented. A major advantage of this system is that the signal is proportional to the optical path length change itself, and not to the sine thereof. The frequency stabilization of the He-Ne laser used-necessary to attain the desired high resolution-is outlined. the Abel inversion procedure, used in a cylindrically symmetrical situation to convert lateral measurements into radial profiles, is discussed. A length-equivalent accuracy of about 0.1 nm has been accomplished. The system has been used to measure the radial profile of the refractive index of RF plasmas in CF4 and Ar.


Materials Science Monographs | 1985

A new approach of plasma deposition

Gmw Gerrit Kroesen; Thj Bisschops; de Jcm Haas; Dc Daan Schram; Cj Timmermans


Plasma Chemistry and Plasma Processing | 1991

Measurement of electron densities by a microwave cavity method in 13.56-MHz RF plasmas of argon, tetrafluoromethane, hexafluoroethane, and trifluoromethane

M Marco Haverlag; Gmw Gerrit Kroesen; Thj Bisschops; Hoog de Fj


Le Journal De Physique Colloques | 1990

Fast plasma deposition of carbon and silicon layers

Jj Beulens; Ajm Buuron; La Bisschops; Thj Bisschops; Abm Bertus Husken; Gmw Gerrit Kroesen; Gj Gijs Meeusen; Cj Timmermans; Atm Wilbers; Dc Daan Schram


ISPC 8 : International symposium on plasma chemistry, Tokyo, August 31 - September 4, 1987, vol. 1 | 1987

Electron densities in an RF etch plasma

Thj Bisschops; Rf Flipsen; Dc Daan Schram


Archive | 1986

Physics of plasma etching and plasma deposition

Dc Daan Schram; de Fj Frits Hoog; Thj Bisschops; Gmw Gerrit Kroesen


Materials Science Monographs | 1986

Plasma parameters and silicon dioxide etch rates in a carbon tetrafluoride plasma

Thj Bisschops; de Fj Frits Hoog; Dc Daan Schram

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Dc Daan Schram

Eindhoven University of Technology

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Gmw Gerrit Kroesen

Eindhoven University of Technology

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de Fj Frits Hoog

Eindhoven University of Technology

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Cj Timmermans

Eindhoven University of Technology

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Abm Bertus Husken

Eindhoven University of Technology

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Ajm Buuron

Eindhoven University of Technology

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Atm Wilbers

Eindhoven University of Technology

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Gj Gijs Meeusen

Eindhoven University of Technology

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Jj Beulens

Eindhoven University of Technology

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