Thomas Altmann

Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer

Process for producing a semiconductor wafer with polished edge

Verfahren zur Herstellung einer Halbleiterscheibe mit verbesserter Ebenheit

Process for material-removing machining of both sides of semiconductor wafers

New double-sided polished semiconductor wafer has extremely low front face site front surface-referenced least squares ratio planarity values varying insignificantly between the wafer edge and central regions

Double-side polishing process with reduced scratch rate and device for carrying out the process

Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process

Production of a semiconductor wafer comprises polishing the edges of the wafer with a cloth with the continuous introduction of an alkaline polishing agent using polishing plates, wetting with a film and cleaning and drying

Process for polishing silicon wafers

Double-sided polishing process for producing a multiplicity of silicon semiconductor wafers