Thomas Altmann | Researchain

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Publication

Featured researches published by Thomas Altmann.

Archive | 2002

Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer

Guido Wenski; Thomas Altmann; Ernst Feuchtinger; Willibald Bernwinkler; Wolfgang Winkler; Gerhard Heier

Archive | 2001

Process for producing a semiconductor wafer with polished edge

Guido Wenski; Thomas Altmann; Gerhard Heier; Wolfgang Winkler

Archive | 1999

Verfahren zur Herstellung einer Halbleiterscheibe mit verbesserter Ebenheit

Thomas Altmann; Guido Wenski; Willi Bernwinkler; Ernst Feuchtinger; Gerhard Heier; Wolfgang Winkler

Archive | 2002

Process for material-removing machining of both sides of semiconductor wafers

Guido Wenski; Thomas Altmann; Gerhard Heier; Wolfgang Winkler; Gunther Kann

Archive | 1999

New double-sided polished semiconductor wafer has extremely low front face site front surface-referenced least squares ratio planarity values varying insignificantly between the wafer edge and central regions

Thomas Altmann; Guido Wenski; Willi Bernwinkler; Ernst Feuchtinger; Gerhard Heier; Wolfgang Winkler

Archive | 2001

Double-side polishing process with reduced scratch rate and device for carrying out the process

Guido Wenski; Johann Glas; Thomas Altmann; Gerhard Heier

Archive | 2001

Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process

Guido Wenski; Gerhard Heier; Wolfgang Winkler; Thomas Altmann

Archive | 2000

Production of a semiconductor wafer comprises polishing the edges of the wafer with a cloth with the continuous introduction of an alkaline polishing agent using polishing plates, wetting with a film and cleaning and drying

Guido Wenski; Thomas Altmann; Gerhard Heier; Wolfgang Winkler

Archive | 2001

Process for polishing silicon wafers

Guido Wenski; Thomas Altmann; Gerhard Heier; Wolfgang Winkler

Archive | 2002

Double-sided polishing process for producing a multiplicity of silicon semiconductor wafers

Guido Wenski; Thomas Altmann; Anton Huber; Alexander Heilmaier

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Archive Network Publication Hotspot Collaboration

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot

Dive into the research topics where Thomas Altmann is active.

Publication

Featured researches published by Thomas Altmann.

Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer

Process for producing a semiconductor wafer with polished edge

Verfahren zur Herstellung einer Halbleiterscheibe mit verbesserter Ebenheit

Process for material-removing machining of both sides of semiconductor wafers

New double-sided polished semiconductor wafer has extremely low front face site front surface-referenced least squares ratio planarity values varying insignificantly between the wafer edge and central regions

Double-side polishing process with reduced scratch rate and device for carrying out the process

Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process

Production of a semiconductor wafer comprises polishing the edges of the wafer with a cloth with the continuous introduction of an alkaline polishing agent using polishing plates, wetting with a film and cleaning and drying

Process for polishing silicon wafers

Double-sided polishing process for producing a multiplicity of silicon semiconductor wafers

Collaboration

Dive into the Thomas Altmann's collaboration.