Thomas Burkhart

Sol-gel synthesis of a diepoxy-crosslinked ormocer adhesive for Cu/polyimide sealing systems

Sol-gel-derived Omocer adhesives starting from methyl-vinyl silanes, diphenyl silanes and tetraethoxy silanes with tailored strain dissipation properties have been synthesized and tailored as hot-melt sealing adhesives for Cu to polyimide. In order to establish an appropriate strain dissipation mechanism within the brittle Ormocer systems used as starting materials, an organic polymer chain based crosslinking reaction, linking amino groupings bonded to silanes together with difunctional epoxides was investigated. For controlling the process, spectroscopic data were used and correlated to peel strength. The system shows a peel strength of 10 N/cm, good dielectric properties and a high heat stability.

Synthesis of high performance Cu/polyimide adhesives based on inorganic-organic composite materials

Sealing of Cu to polyimide in a hot melt process is difficult due to the very different surface properties of Cu and polyimide. Silicone-based systems are widely used due to their heat resistance, but their sealing strength is still rather low. A new hot melt system has been developed by using silane-based oligomers with polar groups (-OH and -NH2) to provide good adhesion and aromatic epoxy units to tailor the stress dissipation ability of the system during the peel test. The system is cured by heat, shows a peel strength of 10 N/cm and is stalbe up to 180 °C. The synthesis principles and the general properties of the system as well as the sealing performance are described.