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Thomas Engling

Infineon Technologies

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Publication

Featured researches published by Thomas Engling.

Archive | 2005

Semiconductor component having a stack of semiconductor chips and method for producing the same

Michael Bauer; Thomas Engling; Alfred Haimerl; Angela Kessler; Joachim Mahler; Wolfgang Schober

Archive | 2004

Microelectromechanical component and method for the production thereof

Thomas Engling; Martin Petz

Archive | 2004

Semiconductor component and sensor component for data transmission devices

Michael Bauer; Thomas Engling; Alfred Haimerl; Joachim Mahler; Wolfgang Schober

Archive | 2006

Bondfolie und Halbleiterbauteil mit Bondfolie sowie Verfahren zu deren Herstellung

Michael Bauer; Thomas Engling; Alfred Haimerl; Angela Kessler; Joachim Mahler; Wolfgang Schober

Archive | 2004

Microelectromechanical pressure sensor and method for the production thereof

Martin Petz; Thomas Engling

Archive | 2005

Halbleiterbauteil mit einem Stapel aus Halbleiterchips und Verfahren zur Herstellung desselben

Michael Bauer; Thomas Engling; Alfred Haimerl; Angela Kessler; Joachim Mahler; Wolfgang Schober

Archive | 2005

Bonding film, semiconductor component comprising a bonding film, and method for the production thereof

Michael Bauer; Thomas Engling; Alfred Haimerl; Angela Kessler; Joachim Mahler; Wolfgang Schober

Archive | 2005

Composant semi-conducteur muni d'un empilement de puces a semi-conducteurs et procede permettant de le produire

Michael Bauer; Thomas Engling; Alfred Haimerl; Angela Kessler; Joachim Mahler; Wolfgang Schober

Archive | 2004

Halbleiterbauteil mit einem stapel aus halbleiterchips und verfahren zur herstellung desselben Of the same semiconductor device having a stack of semiconductor chips and processes for making

Michael Bauer; Thomas Engling; Alfred Haimerl; Angela Kessler; Joachim Mahler; Wolfgang Schober

Archive | 2004

Bondfolie und Halbleiterbauteil mit Bondfolie sowie Verfahren zu deren Herstellung Bond film and semiconductor device having bonding film and to processes for their preparation

Michael Bauer; Thomas Engling; Alfred Haimerl; Angela Kessler; Joachim Mahler; Wolfgang Schober

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Collaboration

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Alfred Haimerl

Infineon Technologies

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Joachim Mahler

Infineon Technologies

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Michael Bauer

Infineon Technologies

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Wolfgang Schober

Infineon Technologies

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Angela Kessler

Infineon Technologies

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Martin Petz

Infineon Technologies

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