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Thomas H. Shilling

Agere Systems

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Archive | 2006

Flip Chip Assembly Having Improved Thermal Dissipation

Ahmed Amin; David L. Crouthamel; John W. Osenbach; Thomas H. Shilling; Brian T. Vaccaro

Archive | 2005

Packaging for electronic modules

Timothy B. Bambridge; Juan A. Herbsommer; Osvaldo Lopez; Joel M. Lott; H. Safar; Thomas H. Shilling

Archive | 2005

Surface-mounting attachment of component

Patricia Marie Albanese; John W. Osenbach; Thomas H. Shilling; ダブリュ．オーゼンバッハ ジョン; エッチ．シリング トーマス; マリー アルバニーズ パトリシア

Archive | 2007

Semiconductor device package with base features to reduce leakage

Patrick J. Carberry; Jeffery J. Gilbert; George John Libricz; Ralph Salvatore Moyer; John W. Osenbach; H. Safar; Thomas H. Shilling

Archive | 2006

Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate

Ahmed Amin; David L. Crouthamel; John W. Osenbach; Thomas H. Shilling; Brian T. Vaccaro

Archive | 2006

Curvature control in integrated circuit device

John W. Osenbach; Thomas H. Shilling; Weidong Xie; シエ ウェイドン; ダブリュ．オーゼンバッハ ジョン; エッチ．シリング トーマス

Archive | 2000

Method of testing an integrated circuit

Vivian Ryan; Thomas H. Shilling

Archive | 2005

Electronic device with surface mount components having stand-off space free of solder mask under the component - method for manfacturing the same

Patricia Marie Albanese; John W. Osenbach; Thomas H. Shilling

Archive | 2000

Integrated circuit and a method of manufacturing an integrated circuit

Vivian Ryan; Thomas H. Shilling

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