Tohru Oka
National Archives and Records Administration
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Featured researches published by Tohru Oka.
IEEE Electron Device Letters | 2008
Tohru Oka; Tomohiro Nozawa
This letter reports normally-off operation of an AlGaN/GaN recessed MIS-gate heterostructure field-effect transistor with a high threshold voltage. The GaN-based recessed MIS-gate structure in conjunction with negative polarization charges under the gate allows us to achieve the high threshold voltage, whereas the low on-state resistance is maintained by the 2-D electron gas remaining in the channel except for the recessed MIS-gate region. The fabricated device exhibits a threshold voltage as high as 5.2 V with a maximum field-effect mobility of 120 cm2/Vmiddots, a maximum drain current of over 200 mA/mm, and a breakdown voltage of 400 V.
compound semiconductor integrated circuit symposium | 2007
Tohru Oka; Masatomo Hasegawa; Michitoshi Hirata; Yoshihisa Amano; Yoshiteru Ishimaru; Hiroshi Kawamura; Keiichi Sakuno
This paper describes technologies of miniaturized high-power low-distortion GaAs HBT power amplifiers with a low-voltage operation for mobile terminals used in 5-6 GHz broadband wireless applications. In conjunction with diode-based linearizing techniques, wideband matching network techniques including trap circuits for second harmonics allow us to obtain a compact broadband power amplifier module with harmonic filtering, achieving the high linear output power at a low supply voltage together with the low distortion and the low second-harmonic spurious outputs in a wide frequency range. The fabricated power amplifier exhibited linear output power levels of 21 and 22 dBm at EVM values of 2.0 and 3.0%, respectively, measured with 54 Mb/s 64-QAM-OFDM signals at a supply voltage of 3.3 V in a frequency range of 5-6 GHz. Second harmonic spurious outputs below -35 dBc were also attained.
international microwave symposium | 2003
Koichiro Fujita; K. Shirakawa; N. Takahashi; Y. Liu; Tohru Oka; Masaharu Yamashita; Keiichi Sakuno; Hiroshi Kawamura; Masatomo Hasegawa; H. Koh; K. Kagoshima; H. Kijima; Hiroya Sato
An InGaP/GaAs two-stage HBT power amplifier for 5 GHz Wireless-LAN applications was developed. By using a self-aligned base contact formation process and an external base region side etching process, a high gain HBT was realized. A small-sized via hole fabrication process was developed. The gain of multi-finger HBT was improved by locating via holes between each finger. Linearity was also improved by developing a new variable negative feedback circuit. A power amplifier MMIC utilizing this technology was fabricated, and 19.7 dBm output power, 22 dB gain, 22.5% power-added-efficiency (PAE), 5.0% error vector magnitude (EVM) were obtained at 54 Mbps transmission under a supply voltage of 3.3 V. These state of the art data represent the highest PAE reported for a the power amplifier MMIC in the 5 GHz Wireless-LAN application.
international microwave symposium | 2005
Tohru Oka; Masatomo Hasegawa; Koichiro Fujita; Masaharu Yamashita; Michitoshi Hirata; Hiroshi Kawamura; Keiichi Sakuno
This paper describes two advanced techniques to enhance linearity and efficiency in HBT power amplifiers (PA) for 5-GHz wireless-LANs (W-LANs). The diode-based linearizing circuit successfully compensates the gain expansion of PAs operating at a low quiescent current. The output matching circuit consisting of on-chip MIM capacitors and bond wires effectively reduces the loss of the circuit as well as allowing the miniaturization of the PA module. The PA MMIC fabricated incorporating these techniques achieved an improvement in linear output power and PAE of 2.4 dBm and 4.8%, respectively, compared to our previous PA with the same device dimensions, and exhibited an output power of 22.1 dBm and a PAE of 27.3% at an EVM of 5%, measured with 54Mbps 64-QAM-OFDM signals at 5.25 GHz.
ieee international symposium on compound semiconductors | 2003
Tohru Oka; Koichiro Fujita; K. Shirakawa; N. Takahashi; Y. Liu; Masaharu Yamashita; Hiroshi Kawamura; Masatomo Hasegawa; H. Koh; K. Kagoshima; H. Kijima; Keiichi Sakuno
We review the technological features of our InGaP power HBTs for 5GHz wireless application. The features include self-aligned base-contact and base-mesa formation process, small-sized via holes located between multi-finger transistors, and bias and feedback circuits for the reduction of distortion. These technologies improve both gain and linearity, producing higher power added efficiency (PAE) in power amplifiers.
compound semiconductor integrated circuit symposium | 2006
Tohru Oka; Masatomo Hasegawa; Michitoshi Hirata; Yoshihisa Amano; Yoshiteru Ishimaru; Hiroshi Kawamura; Keiichi Sakuno
This paper describes a 5-6 GHz band GaAs HBT power amplifier operating at 3.3 V for broadband wireless applications. In conjunction with linearizing circuit techniques, wideband matching circuits including trap circuits for 2nd harmonics allow us to achieve the high linear output power and the low distortion together with low 2nd-harmonic spurious outputs. The fabricated power amplifier exhibited linear output power levels of 21 and 22 dBm at EVM values of 2.0 and 3.0%, respectively, measured with 54 Mbps 64-QAM-OFDM signals. The 2nd harmonic spurious outputs below -35 dBc were also attained
asia-pacific microwave conference | 2006
Tohru Oka; Michitoshi Hirata; Yoshiteru Ishimaru; Hiroshi Kawamura; Keiichi Sakuno
This paper describes a SiGe HBT power amplifier with distortion-controllable bias circuits. MOSFETs employed in the bias circuits enable us to control the distortion of power amplifiers by adjusting the gate voltages. The power amplifier MMIC for 802.11lg wireless LANs fabricated using the technique exhibited excellent linearity and efficiency: a linear output power of 18.3 dBm and a power-added efficiency of 16% were achieved at an EVM of 3%, measured with 54 Mbps 64-QAM OFDM signals at 2.45 GHz.
Electronics Letters | 2008
K. Takatani; T. Nozawa; Tohru Oka; Hiroshi Kawamura; Keiichi Sakuno
Archive | 2007
Tohru Oka; Masatomo Hasegawa
Electronics Letters | 2006
M. Hirata; Tohru Oka; M. Hasegawa; Y. Amano; Y. Ishimaru; Hiroshi Kawamura; Keiichi Sakuno