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Dive into the research topics where Tomas Walander is active.

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Featured researches published by Tomas Walander.


International Journal of Fracture | 2013

Temperature dependence of cohesive laws for an epoxy adhesive in Mode I and Mode II loading

Tomas Walander; Anders Biel; Ulf Stigh

The influence of the temperature on the cohesive laws for an epoxy adhesive is studied in the glassy region, i.e. below the glass transition temperature. Cohesive laws are derived in both Mode I and Mode II under quasi-static loading conditions in the temperature range


International Journal of Fracture | 2014

High cycle fatigue crack growth in Mode I of adhesive layers: modelling, simulation and experiments

Alexander Eklind; Tomas Walander; Thomas Carlberger; Ulf Stigh


ASME 2012 International Mechanical Engineering Congress & Exposition, IMECE 2012, November 9-15, 2012, Houston, Texas, USA | 2012

Influence of Edge-Boundaries on the Cohesive Behaviour of an Adhesive Layer

Anders Biel; Tomas Walander; Ulf Stigh

-30le T le 80^{,circ }


Engineering Fracture Mechanics | 2014

Shear strength of adhesive layers – Models and experiments

Ulf Stigh; Anders Biel; Tomas Walander


Procedia Materials Science | 2014

Fatigue damage of adhesive layers : experiments and models

Tomas Walander; Alexander Eklind; Thomas Carlberger; Ulf Stigh

-30≤T≤80∘C. Three parameters of the cohesive laws are studied in detail: the elastic stiffness, the peak stress and the fracture energy. Methods for determining the elastic stiffness in Mode I and Mode II are derived and evaluated. Simplified bi-linear cohesive laws to be used at any temperature within the studied temperature range are derived for each loading mode. All parameters of the cohesive laws are measured experimentally using only two types of specimens. The adhesive has a nominal layer thickness of 0.3xa0mm and the crack tip opening displacement is measured over the adhesive thickness. The derived cohesive laws thus represent the entire adhesive layer as having the present layer thickness. It is shown that all parameters, except the Mode I fracture energy, decrease with an increasing temperature in both loading modes. The Mode I fracture energy is shown to be independent of the temperature within the evaluated temperature span. At


ECF19 | 2013

A Critical Study of an Alternative Method to Measure Cohesive Properties of Adhesive Layers

Anders Biel; Ulf Stigh; Tomas Walander


International Journal of Adhesion and Adhesives | 2016

Prediction of mixed-mode cohesive fatigue strength of adhesively bonded structure using Mode I data

Tomas Walander; Alexander Eklind; Thomas Carlberger; Ulf Stigh; Andreas Rietz

80^{,circ }


Adhesion Society 37th Annual Meeting, February 23-26, 2014, San Diego, CA | 2014

Effects of the bond line thickness on the fracture mechanical behaviour of structural adhesive joints

Stephan Marzi; Olaf Hesebeck; Markus Brede; Christof Nagel; Anders Biel; Tomas Walander; Ulf Stigh


ECF19 | 2013

An evaluation of the temperature dependence of cohesive properties for two structural epoxy adhesives

Tomas Walander; Anders Biel; Ulf Stigh

80∘C the Mode II fracture energy is decreased to about 2/3 of the fracture energy at


19th European Conference on Fracture (ECF19), Fracture Mechanics for Durability, Reliability and Safety, Kazan, Russia, August 26-31 2012 | 2012

Fracture of Adhesive Layers in Mode II

Ulf Stigh; Anders Biel; Tomas Walander

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Ulf Stigh

University of Skövde

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