Toshiaki Ueno

Membrane probe technology for MCM Known-Good-Die

A new type of membrane probe, which might be called a Universal Membrane Probe (UMP), as a standard Known-Good-Die (KGD) solution for Multichip Module (MCM) manufacture is described. The membrane consists of TAB tape mounted with an array of several thousands micro-bumps. The bumps are connected in a radial pattern and the pitch of the bumps is equal to the pitch of the I/O pads in LSIs. The advantage of this new membrane is that a single wiring pattern is applicable to many die designs without the need for customizing. In this paper, two KGD applications of the new membrane are investigated, one is a wafer probe and the other a burn-in socket.

Universal Membrane Probe for Known Good Die

We propose a new type of membrane probe, which might be called a Universal Membrane Probe (UMP), as a standard Known-Good Die (KGD) solution for Multi Chip Module (MCM) manufacture. In this paper we will give an outline of this new probe, describe the newly developed manufacturing process for it, and evaluate the performance of a prototype probe. The features of this probe are firstly that it is disposable and based on low-cost materials such as Tape Automated Bonding (TAB) tape; secondly, it is non-customized and so applicable to a wide variety of die sizes and pad configurations; and finally it potentially offers a new standard for wafer probing.