Publication


Featured researches published by Toshiharu Ishida.


Archive | 1993

Semiconductor device with reinforcement

Ichiro Miyano; Kooji Serizawa; Suguru Sakaguchi; Toshiharu Ishida


Archive | 2002

Product using Zn-Al alloy solder

Tasao Soga; Toshiharu Ishida; Kazuma Miura; Hanae Hata; Masahide Okamoto; Tetsuya Nakatsuka


Archive | 2001

Electron device and semiconductor device

Tasao Soga; Hanae Shimokawa; Tetsuya Nakatsuka; Masato Nakamura; Yuji Fujita; Toshiharu Ishida; Masahide Okamoto; Koji Serizawa; Toshihiro Hachiya; Hideki Mukuno


Archive | 1993

Method for producing electronic part mounting structure

Suguru Sakaguchi; Toshiharu Ishida; Kooji Serizawa; Hiroyuki Tanaka; Ichiro Miyano; Hiroshi Nakamura


Archive | 2003

Circuit board and electronic device, and method of manufacturing same

Tasao Soga; Hanae Hata; Toshiharu Ishida; Masahide Okamoto; Syougo Senoo; Toshiyuki Kagami; Akihiro Sakashita


Archive | 2002

Pb-free solder-connected structure and electronic device

Hanae Shimokawa; Tasao Soga; Hiroaki Okudaira; Toshiharu Ishida; Tetsuya Nakatsuka; Yoshiharu Inaba; Asao Nishimura


Archive | 1995

SN-ZN SOLDER, SN-ZN-BI SOLDER, METHOD FOR SURFACE TREATMENT OF SAME, AND MOUNTED SUBSTRATE USING IT

Toshiharu Ishida; Tetsuya Nakatsuka; Hideyoshi Shimokawa; Tasao Soga; Kenichi Yamamoto; 英恵 下川; 哲也 中塚; 健一 山本; 太佐男 曽我; 寿治 石田


Archive | 1999

Method and apparatus of manufacturing an electronic circuit board

Tasao Soga; Toshiharu Ishida; Tetsuya Nakatsuka; Hanae Shimokawa; Koji Serizawa; Yasuo Amano; Suguru Sakaguchi; Hiroshi Yamaguchi


Archive | 1999

Lead-free solder connection structure body

Toshiharu Ishida; Hideyoshi Shimokawa; Tasao Soga; 英恵 下川; 太佐男 曽我; 寿治 石田


Archive | 1988

Mounting structure of semiconductor element and manufacture thereof

Toshiharu Ishida; Masaru Sakaguchi; Koji Serizawa; Hiroyuki Tanaka; Toru Yoshida

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