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Toshiko Nakagawa

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Publication

Featured researches published by Toshiko Nakagawa.

Archive | 1997

Microetching composition for copper or copper alloy

Yoshiro Maki; Toshiko Nakagawa; Yasushi Yamada; Takashi Haruta; Maki Arimura

Archive | 2002

Laminate and method of manufacturing the same

Mutsuyuki Kawaguchi; Jun Hisada; Toshiko Nakagawa

Archive | 1996

Microetching method for copper or copper alloy

Yoshiro Maki; Toshiko Nakagawa; Yasushi Yamada; Takashi Haruta; Maki Arimura

Archive | 1994

Composition for treating copper and copper alloy surfaces and method for the surface treatment

Yoshiro Maki; Toshiko Nakagawa; Yoshiaki Furukawa; Minoru Outani; Takashi Haruta; Maki Yamanami; Sachiko Nakamura

Archive | 1999

Method of improving adhesion between copper and resin, and multilayered wiring board manufactured using the same

Takashi Haruta; Masaya Idomoto; Mutsuyuki Kawaguchi; Toshiko Nakagawa; Kenji Toda; 登志子 中川; 昌也 井戸本; 健次 戸田; 孝史 春田; 睦行 河口

Archive | 2004

Bonding layer for bonding resin on copper surface

Mutsuyuki Kawaguchi; Satoshi Amagasaki Saito; Jun Hisada; Toshiko Nakagawa

Archive | 2004

Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby

Mutsuyuki Kawaguchi; Satoshi Amagasaki Saito; Jun Hisada; Naomi Amagasaki Kanda; Toshiko Nakagawa

Archive | 2002

Method for improving adhesive properties of copper or copper alloy to resin, and laminated material

Jun Hisada; Mutsuyuki Kawaguchi; Toshiko Nakagawa; 登志子 中川; 純 久田; 睦行 河口

Archive | 2004

Resin adhesive layer on surface of copper

Jun Hisada; Mutsuyuki Kawaguchi; Toshiko Nakagawa; Tomoshi Saito; 登志子 中川; 純 久田; 知志 斉藤; 睦行 河口

Archive | 1996

Method for microetching copper or copper alloy

Maki Arimura; Takashi Haruta; Yoshiro Maki; Toshiko Nakagawa; Yasushi Yamada

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