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Toshiko Yokota

Akita University

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Publication

Featured researches published by Toshiko Yokota.

Archive | 2003

Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and copper clad laminate obtained by the process

Toshiko Yokota; Susumu Takahashi; Hideaki Matsushima; Makoto Dobashi; Takuya Yamamoto

Archive | 1997

High-tensile electrolytic copper foil and process for producing the same

Hisao Sakai; Toshiko Yokota; Tsutomu Asai; Susumu Takahashi; Mitsuo Suzuki; Makoto Dobashi; Yasuji Hara

Archive | 1994

Organic rust preventive treated copper foil and its production

Makoto Dobashi; Muneharu Ohara; Susumu Takahashi; Yuji Tejima; Toshiko Yokota; 誠 土橋; 宗治 大原; 裕二 手嶋; 俊子 横田; 進 高橋

Archive | 2003

Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such such copper foil with dielectric layer, and method for producing such copper foil with dielectric layer for formation of capacitor layer

Toshiko Yokota; Tetsuhiro Matsunaga; Susumu Takahashi; Hideaki Matsushima; Takuya Yamamoto; Makoto Dobashi

Archive | 1997

High tensile strength electrodeposited copper foil and process of electrodepositing thereof

Hisao Sakai; Toshiko Yokota; Tsutomu Asai; Susumu Takahashi; Mitsuo Suzuki; Makoto Dobashi; Yasuji Hara

Archive | 1994

ORGANIC ANTICORROSIVE TREATED COPPER FOIL

Makoto Dobashi; Hiroshi Hata; Hisao Sakai; Susumu Takahashi; Toshiko Yokota; Atsushi Yoshioka; 淳志 吉岡; 誠 土橋; 俊子 横田; 洋志 端; 久雄 酒井; 進 高橋

Archive | 2004

Two-layer flexible copper clad laminate, and method of producing the two-layer flexible copper clad laminate

Makoto Dobashi; Masato Ishii; Hideaki Matsushima; Susumu Takahashi; Toshiko Yokota; 誠 土橋; 英明 松嶋; 俊子 横田; 正人 石井; 進 高橋

Archive | 2002

METHOD OF MANUFACTURING FLEXIBLE PRINTED WIRING BOARD AND FLEXIBLE PRINTED WIRING BOARD OBTAINED WITH THE SAME METHOD

Makoto Dobashi; Hideaki Matsushima; Naotomi Takahashi; Toshiko Yokota; 土橋 誠; 松嶋 英明; 横田 俊子; 高橋 直臣

Archive | 1995

Copper foil for use in making printed wiring board

Makoto Dobashi; Toshiko Yokota; Hiroshi Hata; Hiroaki Tsuyoshi; Muneharu Ohara

Archive | 2009

Roughening-processed copper foil, method of manufacturing roughening-processed copper foil and copper clad laminate

Makoto Dobashi; Susumu Nishikawa; Toshiko Yokota; 誠 土橋; 俊子 横田; 丞 西川

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Makoto Dobashi

Utsunomiya University

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Sachio Yoshihara

Utsunomiya University

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Takashi Shirakashi

Utsunomiya University

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Hiroyuki Kaneko

Akita University

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Noriko Hanzawa

Tokyo University of Science

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Ichiro Ogura

Samsung Electro-Mechanics

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