Toshimasa Sugimura | Researchain

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Featured researches published by Toshimasa Sugimura.

Archive | 2010

Dicing tape-integrated film for semiconductor back surface

Naohide Takamoto; Goji Shiga; Fumiteru Asai; Toshimasa Sugimura

Archive | 2010

ADHESIVE SHEET FOR DICING SEMICONDUCTOR WAFER AND METHOD FOR DICING SEMICONDUCTOR WAFER USING THE SAME

Toshimasa Sugimura; Tomokazu Takahashi; Noriyoshi Kawashima; Fumiteru Asai

Archive | 2011

Method for processing wafer

Toshimasa Sugimura; Akinori Nishio; Kazuyuki Kiuchi

Archive | 2014

METHOD OF MANUFACTURING AN LED

Tomokazu Takahashi; Shinya Akizuki; Toshimasa Sugimura; Takeshi Matsumura; Daisuke Uenda

Archive | 2011

METHOD FOR SEPARATING AND REMOVING DICING SURFACE PROTECTION TAPE FROM OBJECT TO BE CUT

Toshimasa Sugimura; Akinori Nishio; Kazuyuki Kiuchi

Archive | 2011

ADHESIVE TAPE OR SHEET WITH RELEASE LINER

Shigeki Ishiguro; Takumi Yutou; Hiroki Senda; Masamichi Matsumoto; Kenichi Nishijima; Ryoko Asai; Yuka Sekiguchi; Yuji Okawa; Michihito Ooishi; Toshimasa Sugimura

Archive | 2011

ROLLED ADHESIVE TAPE OR SHEET

Shigeki Ishiguro; Takumi Yutou; Hiroki Senda; Masamichi Matsumoto; Kenichi Nishijima; Toshitaka Suzuki; Fumiteru Asai; Isamu Miyoshi; Michihito Ooishi; Toshimasa Sugimura

Archive | 2014

Resin for temporary adhesion, resin layer for temporary adhesion, hard substrate provided with resin layer for temporary, thin-film substrate layered body, and process for processing thin-film substrate

Toshio Shintani; 寿朗新谷; Masaaki Mori; 将明森; Tamao Fukushima; 玉青福島; Kenta Hata; 健太秦; Toshimasa Sugimura; 敏正杉村; Shinya Akizuki; 秋月伸也; Tomokazu Takahashi; 高橋智一

Archive | 2014