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Dive into the research topics where Toshizumi Yoshino is active.

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Featured researches published by Toshizumi Yoshino.


electronic components and technology conference | 2008

Photo imageable solder resist for semiconductor packages

Toshizumi Yoshino; Hideyuki Katagi; Kuniaki Sato

Photo imageable solder resist is used as insulating material. By using photo imageable solder resist, electro devices such as a semiconductor chip and a condenser are insulated to a wiring circuit and an electrode, when they are mounted on the surface of a printed wiring board.


Archive | 2004

Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and method for manufacturing printed wiring board

Takeshi Endo; Yasushi Kojima; Bungo Ochiai; Kuniaki Sato; Toshizumi Yoshino; 邦明 佐藤; 利純 吉野; 靖 小島; 文吾 落合; 剛 遠藤


Archive | 1998

Photo curable resin composition and photosensitive element

Kuniaki Sato; Hiroaki Hirakura; Toshihiko Ito; Takao Hirayama; Toshizumi Yoshino


Archive | 2000

Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, resist pattern and substrate having the resist pattern laminated thereon

Kuniaki Satou; Takahiko Kutsuna; Toshizumi Yoshino; Takao Hirayama; Mikio Uzawa


Archive | 2008

Photosensitive resin composition for protective film of printed wiring board for semiconductor package

Kazuhiko Kurafuchi; Toshizumi Yoshino; Hideyuki Katagi; Masaya Ookawa; Yoshiaki Fuse


Archive | 2008

Black-colored photosensitive resin composition, method for formation of black matrix, method for production of color filter, and color filter

Yukio Kamiya; Toshizumi Yoshino; Kuniaki Sato


Archive | 2004

Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film

Kuniaki Sato; Hiroaki Hirakura; Toshihiko Ito; Takao Hirayama; Toshizumi Yoshino


Archive | 2003

Photosensitive resin composition, and photosensitive element, method for forming resist pattern and printed wiring board using the composition

Toshizumi Yoshino; Kuniaki Satou; Masayoshi Joumen; Masayuki Hama; Keishi Hamada; Tsutomu Mamiya; Tooru Katsurahara; Kennichi Kawaguchi


Archive | 2007

Photosensitive resin composition, resist pattern forming method using same, and method for producing printed wiring board

Hideyuki Kataki; Masaya Okawa; Kuniaki Sato; Toshizumi Yoshino; 邦明 佐藤; 利純 吉野; 昌也 大川; 秀行 片木


Archive | 2002

Photosensitive resin composition, photosensitive element using the same, method for forming resist pattern and printed wiring board

Masayuki Hama; Keiji Hamada; Takao Hirayama; Masayoshi Kamitsura; Hideyuki Kataki; Masatoshi Kono; Yoko Kurisaki; Kuniaki Sato; Toshizumi Yoshino; 上面 雅義; 佐藤 邦明; 吉野 利純; 平山 隆雄; 栗崎 庸行; 河野 正年; 浜 真之; 濱田 啓司; 片木 秀行

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