V. Babu

Construction and test of the first Belle II SVD ladder implementing the origami chip-on-sensor design

The Belle II Silicon Vertex Detector comprises four layers of double-sided silicon strip detectors (DSSDs), consisting of ladders with two to five sensors each. All sensors are individually read out by APV25 chips with the Origami chip-on-sensor concept for the central DSSDs of the ladders. The chips sit on flexible circuits that are glued on the top of the sensors. This concept allows a low material budget and an efficient cooling of the chips by a single pipe per ladder. We present the construction of the first SVD ladders and results from precision measurements and electrical tests.

Belle II silicon vertex detector

The Belle II experiment at the SuperKEKB collider in Japan is designed to indirectly probe new physics using approximately 50 times the data recorded by its predecessor. An accurate determination of the decay-point position of subatomic particles such as beauty and charm hadrons as well as a precise measurement of low-momentum charged particles will play a key role in this pursuit. These will be accomplished by an inner tracking device comprising two layers of pixelated silicon detector and four layers of silicon vertex detector based on double-sided microstrip sensors. We describe herein the design, prototyping and construction efforts of the Belle-II silicon vertex detector.

First model-independent Dalitz analysis of B 0 → DK ∗ 0 B0→DK∗0, D → K S 0 π + π − D→KS0π+π− decay

We report a measurement of the amplitude ratio

First Observation of the Decay B0->psi(2S)pi0

r_S

The silicon vertex detector of the Belle II experiment

of

The Belle II SVD data readout system

B^0 \to D^0K^{*0}

Belle-II VXD radiation monitoring and beam abort with sCVD diamond sensors

and

Measurements of isospin asymmetry and difference of direct

B^0 \to \bar{D^0}K^{*0}

CP

decays with a Dalitz analysis of

asymmetries in

D\to K_S^0\pi^+\pi^-