V. Janicek

Analysis and Measurement of Capacitive Coupling in Integrated Circuits

Parasitic electromagnetic couplings result in the transfer of interfering energy from the interference source to the interference receiver. Inside the ICs the principal sources of interference are usually the clock circuits, output drivers and other circuits with low output impedance. The most frequent receivers of interference are the input circuits, flip-flops and circuits with high input impedance. The small distances of leads result in increased signal crosstalk inside the integrated circuit.

Coupling Capacitances of Connecting-lead Systems in Integrated Circuits

The development of integrated circuits has reached a situation today that the circuit operating speed is not limited by the parameters of the transistors any more, but rather by the electrical parameters of the interconnections inside the integrated circuit (Kropewnicki, 2002). For this reason, it is necessary to take in account the properties of interconnecting conductors from the start of the circuit design process. Undesirable parasitic electromagnetic couplings appear between the interconnecting lines, causing the transfer of interfering impulses onto the signal-carrying lines. These interfering impulses then result in random errors and/or disturbances in the integrated circuit

Energy harvesting in 3D

This paper describes the design and evaluation of 3D electrostatic energy harvester. It is based on electrostatic converter and uses the principle of conversion of non-electric energy into electrical energy by periodical modification of gap between electrodes of a capacitor. The structure is designed and modelled as three-dimensional silicon based MEMS. Innovative approach made it possible to reach very low resonant frequency of approx. 100 Hz. A modified long cantilever damping spring design has been used. The structure can move in all 3 axes of coordinate system and can be mechanically tuned to reach desired parameters.

Intelligent Sensor Network for Physical Quantities Measurement

The article solves the design and implementation of a simple intelligent sensor network for physical quantities measurement. The system uses wireless data transmission. Sensor network is designed as a basic element of the ZigBee network. Each unit has a sensor attached to a microcontroller. The system is controlled by PC, the variable arrangement can be used. The different type of the sensor can be used. The system can be extended to other types of sensors for measuring the chemical variables. The data transfer from PC can be transmitted by internet.

Influence of conductor systems on the crosstalks in integrated circuits

The advent of novel sub-micron technologies of IC fabrication led to such a decrease in lead-to-lead separation that it is not possible any more to neglect the influence of these leads on the reliability of the system operation. Both the small lead separation and the application of multilayer interconnecting systems cause parasitic electromagnetic couplings [1]; in the case of a unipolar CMOS technology, the capacitive coupling is the dominant effect. It is impossible to measure direct the rapid variations voltage between leads inside the IC.

Microsystem models in integrated pressure sensor design

The paper describes design of a simple microsystem structure of capacity pressure circuit with integrated inductance on a single Si chip. Model system with corresponding software support is utilized for design. Different models were designed for simulation of the properties of the designed structure. Model of the substitute electronic circuit involves active and parasitic elements. The properties of this equivalent model are explored using the SPICE circuit simulator. Mechanical properties of the structure are explored using the CoventorWare program. Distribution of mechanical stress and boundary parameters are the most important ones. The paper describes flow of design software. Tools used for the design of integrated structure are described as well. Parasitic elements influencing resulting parameters are discussed; equivalent circuit connection of the integrated structure including calculation of theoretical numeric values of these elements is designed. Various modifications of integrated structure are designed and realized. The paper is completed with reached results.

Intelligent sensor structure for tilt measure

There is described approach to the development of functional and system model of the structure. In the paper, there is described a concept of structure of an intelligent sensor system for tilt measurement. Principle of an accelerometer is used for the measurement. The paper describes conceptual approach to the design of a tilt structure determined for integration on a chip. An accelerometer for measurement of inclination in x and y axes is used as a sensor. For construction non-standard connection with accelerometer is used. Measurement is controlled by a microprocessor. measured data are sent to a PC via RS232. The PC is used for data storage, further calculations and display of measured tilt. A hardware model has been developed for verification of properties. Model properties have been simulated using simulators of electronic circuits. The sensor system is temperature compensated. Lab View development tool is utilized for service program.

Integrated pressure sensor - use of microsystems model flow

The paper describes flow of design software of a simple microsysfem structure for a capacity measurement. The base of structure is capacity pressure circlIi! with integrated inductance on a single Si chip. An integrated one-chip passive microsensor as resonance circuit has been designed and realised The maximum size of the whole integrated circuit can be 3x3 mm. The capacitor area of Ixl mm is chosen. Model system with corresponding software support is utilized jar design. Tools used for the design of integrated structure are described as well. Different models were designed for simulation of the properties of the designed structure. Model of the substitute electronic circuit involves active and parasitic elements. The properties of this eqUivalent model are explored using the SPICE circuit simulator. Mechanical properties of the structure are explored using the CoventorWare program. Distribution of mechanical stress and boundary parameters are the most important ones. Various modifications of integrated structure are designed ond realised.

Frequency characteristic of the capacitive coupling in CMOS integrated circuits

Parasitic electromagnetic couplings result in the transfer of interfering energy from the interference source to (he interference receiver. Inside the Ies the principal sources of interference are usually the clock circuits, output drivers and other circuits with low output impedance. The most frequent receivers of inteiference are the input circuits, flip-flops and circuits with high input impedance. The small distances of leads result in increased signal crosstalk inside the integrated circuit.