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Dive into the research topics where Vesna Jović is active.

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Featured researches published by Vesna Jović.


Infrared Physics | 1989

Quantum efficiency and responsivity of InSb photodiodes utilizing the Moss-Burstein effect

Z. Djuric; Branko Livada; Vesna Jović; Miloljub Smiljanic; Milan Matić; Zarko Lazic

Abstract In this work a detailed analysis of the quantum efficiency of InSb n+-p photodetectors produced by liquid phase epitaxy is given, in the case when the n+ region is doped to such a level that the Moss-Burstein effect plays an important role. Our starting point was the theoretically determined coefficient of intrinsic absorption and derived expressions for the generated photocurrent in the n+ region, depletion layer and p-phase of the photodetector. The results are presented in the form of graphical dependence of the quantum efficiency on the wavelength, with the electron concentration in the n+ layer as a parameter.


Serbian Journal of Electrical Engineering | 2017

Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films

Ivana Mladenović; J. Lamovec; Vesna Jović; Vesna Radojević

Thin copper films were electrodeposited on a polycrystalline coldrolled copper substrate. The composition of the laboratory-made copper sulphate electrolyte was changed by the addition of various additives. The influence of chloride ion (Cl), polyethylene glycol (PEG) and 3-mercapto-1-propane sulfonic acid (MPSA) on mechanical and adhesion properties of the electrodeposited copper films was investigated using Vickers microindentation technique. Calculations of the film hardness and adhesion were carried out using composite hardness models of Korsunsky and Chen-Gao. The hardness of the composite system is influenced by the adhesion of the copper film to the substrate. Increasing adhesion corresponds to increasing values of the calculated adhesion parameter b, named the critical reduced depth. When additives are added to a plating solution, the copper deposition mechanism is changed and fine-grained microstructure without the formation of microscopic nodules is obtained.


Journal of Micromechanics and Microengineering | 2012

Maskless convex corner compensation technique on a (1 0 0) silicon substrate in a 25 wt% TMAH water solution

M. Smiljanic; Vesna Jović; Žarko Lazić


Journal of The Serbian Chemical Society | 2009

Micromechanical and structural properties of nickel coatings electrodeposited on two different substrates

J. Lamovec; Vesna Jović; Radoslav Aleksić; Vesna Radojević


Journal of The Serbian Chemical Society | 1999

Investigation of Hg 1-X Cdx te epitaxial vapor phase growth under isothermal conditions

Vesna Jović; Zoran Djinovic


Zastita materijala | 2018

Obtaining and characterization of multilayer nickel thin films electrodeposited with the assistance of ultrasonic agitation

J. Lamovec; Ivana Mladenović; Vesna Jović; Vesna Radojević; Stevo Jaćimovski; Goran Jovanov


Ceramics International | 2018

Influence of annealing temperature on structural, optical and photocatalytic properties of TiO2-CeO2 nanopowders

Ljiljana Rožić; Srđan Petrović; Davor Lončarević; Boško Grbić; Nenad Radić; Stevan Stojadinović; Vesna Jović; J. Lamovec


Advanced Powder Technology | 2018

Optimization of a nanoparticle ball milling process parameters using the response surface method

Srdjan Petrović; Ljiljana Rožić; Vesna Jović; Stevan Stojadinović; Boško Grbić; Nenad Radić; J. Lamovec; Rastko Vasilić


Zastita materijala | 2015

Indentation behaviour of 'soft film on hard substrate' composite system type

J. Lamovec; Vesna Jović; Ivana Mladenović; D. Stojanović; Aleksandar Kojović; Vesna Radojević


Tehnika | 2015

Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies

J. Lamovec; Vesna Jović; Ivana Mladenović; Bogdan Popović; Vesna Radojević

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J. Lamovec

University of Belgrade

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