Vijit A. Sabnis

43.5% Efficient Lattice Matched Solar Cells

The most common triple-junction solar cell design which has been commercially available to date utilizes a germanium bottom cell with an (In)GaAs and InGaP middle and top cell respectively. This type of device has a well-known efficiency limitation somewhere around 40% at 500 suns. Higher efficiencies can be obtained by changing the effective bandgaps of the three junctions, but the choice of materials and approaches to do so is very limited. We at Solar Junction have adopted the dilute nitride material system to obtain these new bandgaps, and break through the 40% efficiency barrier. The unique advantage of the dilute nitrides is that the bandgap and lattice constant can be tuned independently, allowing bulk material lattice matched to Germanium or GaAs over a wide range of bandgaps. The dilute nitride technology in our first commercial product has enabled us to maximize the efficiency of a triple junction solar cell by using the optimal set of bandgaps (including one around 1eV). Commercial Solar Junction concentrator cells with efficiencies of 43.5% have been independently verified by NREL and Fraunhofer. These higher efficiencies are generally the result of higher output voltage, not higher current, which keeps system-level resistive wiring losses in check.

High-efficiency multijunction solar cells employing dilute nitrides

Solar Junction has developed a set of dilute nitride compound semiconductors with antimony that offer tunable absorption between the GaAs and Ge bandedges, while retaining lattice matching to GaAs or Ge substrates. By replacing the Ge junction in a conventional triple junction solar cell with a GaInNAsSb junction, world record cell efficiencies of 43.5% have been achieved, and CPV module efficiencies (DC) exceeding 35% may now be possible in the near future.

Growth, processing, and optical properties of epitaxial Er_2O_3 on silicon

Erbium-doped materials have been investigated for generating and amplifying light in low-power chip-scale optical networks on silicon, but several effects limit their performance in dense microphotonic applications. Stoichiometric ionic crystals are a potential alternative that achieve an Er(3+) density 100 x greater. We report the growth, processing, material characterization, and optical properties of single-crystal Er (2)O(3) epitaxially grown on silicon. A peak Er(3+) resonant absorption of 364 dB/cm at 1535 nm with minimal background loss places a high limit on potential gain. Using high-quality microdisk resonators, we conduct thorough C/L-band radiative efficiency and lifetime measurements and observe strong upconverted luminescence near 550 and 670 nm.

Ultrafast differential sample and hold using low-temperature-grown GaAs MSM for photonic A/D conversion

This letter demonstrates an ultrafast sample and hold circuit using optically triggered metal-semiconductor-metal switches made of low-temperature-grown GaAs for use in a photonic analog-to-digital conversion system. A differential configuration is incorporated to reduce feedthrough noise.

Multifunctional integrated photonic switches

Traditional optical-electronic-optical (o-e-o) conversion in todays optical networks requires cascading separately packaged electronic and optoelectronic chips and propagating high-speed electrical signals through and between these discrete modules. This increases the packaging and component costs, size, power consumption, and heat dissipation. As a remedy, we introduce a novel, chip-scale photonic switching architecture that operates by confining high-speed electrical signals in a compact optoelectronic chip and provides multiple network functions on such a single chip. This new technology features low optical and electrical power consumption, small installation space, high-speed operation, two-dimensional scalability, and remote electrical configurability. We present both theoretical and experimental discussion of our monolithically integrated photonic switches that incorporate quantum-well waveguide modulators directly driven by on-chip surface-illuminated photodetectors. These switches can be conveniently arrayed two-dimensionally on a single chip to realize a number of network functions. Of those, we have experimentally demonstrated arbitrary wavelength conversion across 45 nm and dual-wavelength broadcasting over 20 nm, both spanning the telecommunication center band (1530-1565 nm) at switching speeds up to 2.5 Gb/s. Our theoretical calculations predict the capability of achieving optical switching at rates in excess of 10 Gb/s using milliwatt-level optical and electrical switching powers.

Dual-diode quantum-well modulator for C-band wavelength conversion and broadcasting

We present a dual-diode, InGaAsP/InP quantum-well modulator that incorporates a monolithically-integrated, InGaAs photodiode as a part of its on-chip, InP optoelectronic circuit. We theoretically show that such a dual-diode modulator allows for wavelength conversion with 10-dB RF-extinction ratio using 7 mW absorbed optical power at 10 Gb/s. We experimentally demonstrate unlimited wavelength conversion across 45 nm between 1525 nm and 1570 nm, and dual-wavelength broadcasting over 20 nm between 1530 nm and 1565 nm, spanning the entire C-band with >10dB RF-extinction ratio and using 3.1-6.7 mW absorbed optical power at 1.25 Gb/s.

Optically controlled electroabsorption modulators for unconstrained wavelength conversion

We introduce a proof-of-concept, optically controlled, optical switch based on the monolithic integration of a surface-illuminated photodetector and a waveguide electroabsorption modulator. We demonstrate unconstrained wavelength conversion over the entire center telecommunication wavelength band (C band) and optical switching up to 2.5 Gbit/s with extinction ratios exceeding 10 dB. Our approach offers both high-speed, low-power, switching operation and two-dimensional array scalability for the fabrication of chip-scale reconfigurable multichannel wavelength converters.

Self-aligning planarization and passivation for integration applications in III-V semiconductor devices

This work reports an easy planarization and passivation approach for the integration of III-V semiconductor devices. Vertically etched III-V semiconductor devices typically require sidewall passivation to suppress leakage currents and planarization of the passivation material for metal interconnection and device integration. It is, however, challenging to planarize all devices at once. This technique offers wafer-scale passivation and planarization that is automatically leveled to the device top in the 1-3-/spl mu/m vicinity surrounding each device. In this method, a dielectric hard mask is used to define the device area. An undercut structure is intentionally created below the hard mask, which is retained during the subsequent polymer spinning and anisotropic polymer etch back. The spin-on polymer that fills in the undercut seals the sidewalls for all the devices across the wafer. After the polymer etch back, the dielectric mask is removed leaving the polymer surrounding each device level with its device top to atomic scale flatness. This integration method is robust and is insensitive to spin-on polymer thickness, polymer etch nonuniformity, and device height difference. It prevents the polymer under the hard mask from etch-induced damage and creates a polymer-free device surface for metallization upon removal of the dielectric mask. We applied this integration technique in fabricating an InP-based photonic switch that consists of a mesa photodiode and a quantum-well waveguide modulator using benzocyclobutene (BCB) polymer. We demonstrated functional integrated photonic switches with high process yield of >90%, high breakdown voltage of >25 V, and low ohmic contact resistance of /spl sim/10 /spl Omega/. To the best of our knowledge, such an integration of a surface-normal photodiode and a lumped electroabsorption modulator with the use of BCB is the first to be implemented on a single substrate.

Integrated photonic switches for nanosecond packet-switched optical wavelength conversion

We present a multifunctional photonic switch that monolithically integrates an InGaAsP/InP quantum well electroabsorption modulator and an InGaAs photodiode as a part of an on-chip, InP optoelectronic circuit. The optical multifunctionality of the switch offers many configurations to allow for different optical network functions on a single chip. Here we experimentally demonstrate GHz-range optical wavelength-converting switching with only ~10 mW of absorbed input optical power, electronically controlled packet switching with a reconfiguration time of <2.5 ns, and optically controlled packet switching in <300 ps.

Scalable wavelength-converting crossbar switches

We report scalable low-power wavelength-converting crossbar switches that monolithically integrate two-dimensional compact arrays of surface-normal photodiodes with quantum-well waveguide modulators. We demonstrate proof-of-concept, electrically reconfigurable 2/spl times/2 crossbars that perform unconstrained wavelength conversion across 35 nm in the C-band (1530-1565 nm), using only <4.3-mW absorbed input optical power, and with 10-dB extinction ratio at 1.25 Gb/s. Such wavelength-converting crossbars provide complete flexibility to selectively convert any of the input wavelengths to any of the output wavelengths at high data bit rates in telecommunication, with the input and output wavelengths being arbitrarily chosen within the C-band.