Vitaly Z. Zubialevich

Luminescence and Stimulated Emission from GaN on Silicon Substrates Heterostructures

Photoluminescence (PL) and stimulated emission of GaN/Si layers grown by MOVPE with AIN and AlGaN buffers have been investigated. It has been found that thermal annealing of samples in nitrogen gas flow leads to an increase of the PL efficiency of up to 20 times, with a thermal activation energy of this process of 3.1-3.4 eV. The annealing promotes a significant decrease of the non-radiative center concentration and an increase of the number of shallow states. The laser action at λ = 377 nm under pulsed optical excitation was achieved at room temperature evidencing a high quality of the samples.

Epitaxial lateral overgrowth of AlN on self-assembled patterned nanorods

We report an inexpensive nanoscale patterning process for epitaxial lateral overgrowth (ELOG) in AlN layers grown by metal organic vapour phase epitaxy (MOVPE) on sapphire. The pattern was produced by an inductively coupled plasma etch using a self-assembled monolayer of silica spheres on AlN as the lithographic mask. The resulting uniform 1 μm length rod structure across a wafer showed a massive reduction in threading dislocations (TDs) when annealed at 1100 °C. Overgrowing homoepitaxial AlN on top of the nanorods, at a temperature of 1100 °C, produced a crack free coalesced film with approximately 4 μm of growth, which is formed at a much lower temperature compared to that typically required for microscale ELOG. The improved crystal quality, in terms of TD reduction, of the AlN above the rods was determined by detailed weak beam (WB) electron microscopy studies and showed that the threading dislocation density (TDD) was greatly reduced, by approximately two orders of magnitude in the case for edge-type dislocations. In situ reflectance measurements during the overgrowth allowed for thickness coalescence to be estimated along with wafer curvature changes. The in situ measurements also confirmed that tensile strain built up at a much slower rate in the ELOG AlN layer compared to that of AlN prepared directly on sapphire.

Fully Porous GaN p–n Junction Diodes Fabricated by Chemical Vapor Deposition

Porous GaN based LEDs produced by corrosion etching techniques demonstrated enhanced light extraction efficiency in the past. However, these fabrication techniques require further postgrown processing steps, which increases the price of the final system. Also, the penetration depth of these etching techniques is limited, and affects not only the semiconductor but also the other elements constituting the LED when applied to the final device. In this paper, we present the fabrication of fully porous GaN p-n junctions directly during growth, using a sequential chemical vapor deposition (CVD) process to produce the different layers that form the p-n junction. We characterized their diode behavior from room temperature to 673 K and demonstrated their ability as current rectifiers, thus proving the potential of these fully porous p-n junctions for diode and LEDs applications. The electrical and luminescence characterization confirm that high electronic quality porous structures can be obtained by this method, and we believe this investigation can be extended to other III-N materials for the development of white light LEDs, or to reduce reflection losses and narrowing the output light cone for improved LED external quantum efficiencies.

Blue InGaN/GaN multiple-quantum-well optically pumped lasers with emission wavelength in the spectral range of 450–470 nm

Optically pumped lasing in the wavelength range of 450–470 nm in InGaN/GaN multiple-quantum-well heterostructures grown by metalorganic vapor phase epitaxy was achieved and investigated. The energy and power per pulse of the laser were 80 nJ and 10 W correspondingly for one facet at room temperature. The far-field patterns of the laser emission consisted of three light spots near the angles of +30°, −15°, and −45°. The highest operating temperature was 450 K. The photoluminescence and photoluminescence excitation spectrum structures suggest that the quantum dots inside the quantum wells are involved in the recombination mechanism.

Luminescence and lasing in InGaN∕GaN multiple quantum well heterostructures grown at different temperatures

It was found that the decrease of the InGaN∕GaN multiple quantum well (MQW) growth temperature from 865 to 810 °C leads to a MQW emission wavelength shift from the violet to the green spectral region. The lowering of the growth temperature also promotes a decrease of the MQW photoluminescence (PL) intensity at high excitation and a disappearance of the excitonic features from the low-temperature reflection and PL spectra of GaN barriers and claddings. The laser threshold dependence on Tg is not monotonic, with the lowest value of 270kW∕cm2 at Tg=830°C. High-temperature annealing (900 °C, 30 min) leads to a twofold increase of the PL efficiency only from the InGaN QWs grown at the lowest temperature. The results allow one to explain the laser threshold behavior in terms of the heterostructure quality, the defect concentration, In clusterization, and the piezoelectric field dependence on the MQW growth temperature.

Comparative study of polar and semipolar (112⁻2) InGaN layers grown by metalorganic vapour phase epitaxy

InGaN layers were grown simultaneously on (112¯2) GaN and (0001) GaN templates by metalorganic vapour phase epitaxy. At higher growth temperature (≥750 °C), the indium content (<15%) of the (112¯2) and (0001) InGaN layers was similar. However, for temperatures less than 750 °C, the indium content of the (112¯2) InGaN layers (15%–26%) were generally lower than those with (0001) orientation (15%–32%). The compositional deviation was attributed to the different strain relaxations between the (112¯2) and (0001) InGaN layers. Room temperature photoluminescence measurements of the (112¯2) InGaN layers showed an emission wavelength that shifts gradually from 380 nm to 580 nm with decreasing growth temperature (or increasing indium composition). The peak emission wavelength of the (112¯2) InGaN layers with an indium content of more than 10% blue-shifted a constant value of ≈(50–60) nm when using higher excitation power densities. This blue-shift was attributed to band filling effects in the layers.

Fabrication of p-type porous GaN on silicon and epitaxial GaN

Porous GaN layers are grown on silicon from gold or platinum catalyst seed layers, and self-catalyzed on epitaxial GaN films on sapphire. Using a Mg-based precursor, we demonstrate p-type doping of the porous GaN. Electrical measurements for p-type GaN on Si show Ohmic and Schottky behavior from gold and platinum seeded GaN, respectively. Ohmicity is attributed to the formation of a Ga2Au intermetallic. Porous p-type GaN was also achieved on epitaxial n-GaN on sapphire, and transport measurements confirm a p-n junction commensurate with a doping density of ∼1018 cm−3. Photoluminescence and cathodoluminescence confirm emission from Mg-acceptors in porous p-type GaN.

Multiple quantum well InGaN/GaN blue optically pumped lasers operating in the spectral range of 450-470 nm

Lasing under optical pumping by N 2 -laser radiation in InGaN/GaN multiple quantum well heterostructures grown in AIXTRON MOVPE reactors was achieved and investigated in the wavelength range of 450-470 nm. The laser operation wavelength depends most strongly on V/III ratio during quantum well barrier growth. The total energy and power per pulse of the laser were 300 nJ and 40 W, respectively, with differential quantum efficiency of 3% at room temperature. The laser threshold increases exponentially with increasing operation wavelength which is mainly due to the decreasing efficiency of the spontaneous emission and due to an increase of its spectral width.

GaN Nanowire Schottky Barrier Diodes

A new concept of vertical gallium nitride (GaN) Schottky barrier diode based on nanowire (NW) structures and the principle of dielectric REduced SURface Field (RESURF) is proposed in this paper. High-threading dislocation density in GaN epitaxy grown on foreign substrates has hindered the development and commercialization of vertical GaN power devices. The proposed NW structure, previously explored for LEDs offers an opportunity to reduce defect density and fabricate low cost vertical GaN power devices on silicon (Si) substrates. In this paper, we investigate the static characteristics of high-voltage GaN NW Schottky diodes using 3-D TCAD device simulation. The NW architecture theoretically achieves blocking voltages upward of 700 V with very low specific on-resistance. Two different methods of device fabrication are discussed. Preliminary experimental results are reported on device samples fabricated using one of the proposed methods. The fabricated Schottky diodes exhibit a breakdown voltage of around 100 V and no signs of current collapse. Although more work is needed to further explore the nano-GaN concept, the preliminary results indicate that superior tradeoff between the breakdown voltage and specific on-resistance can be achieved, all on a vertical architecture and a foreign substrate. The proposed NW approach has the potential to deliver low cost reliable GaN power devices, circumventing the limitations of today’s high electron mobility transistors (HEMTs) technology and vertical GaN on GaN devices.

Strongly nonparabolic variation of the band gap in In x Al1−x N with low indium content

80–120 nm thick In x Al1−x N epitaxial layers with 0 < x < 0.224 were grown by metalorganic vapour phase epitaxy on AlN/Al2O3-templates. The composition was varied through control of the growth temperature. The composition dependence of the band gap was estimated from the photoluminescence excitation absorption edge for 0 < x < 0.11 as the material with higher In content showed no luminescence under low excitation. A very rapid decrease in band gap was observed in this range, dropping down below 5.2 eV at x = 0.05, confirming previous theoretical work that used a band-anticrossing model to describe the strongly x-dependent bowing parameter, which in this case exceeds 25 eV in the x → 0 limit. A double absorption edge observed for InAlN with x < 0.01 was attributed to crystal-field splitting of the highest valence band states. Our results indicate also that the ordering of the valence bands is changed at much lower In contents than one would expect from linear interpolation of the valence band parameters. These findings on band gap bowing and valence band ordering are of direct relevance for the design of InAlN-containing optoelectronic devices.