Vito Basile

Rapid Prototyping of Plastic Lab-on-a-Chip by Femtosecond Laser Micromachining and Removable Insert Microinjection Molding

We have introduced a new hybrid fabrication method for lab-on-a-chip devices through the combination of femtosecond laser micromachining and removable insert micro-injection molding. This method is particularly suited for the fast prototyping of new devices, while maintaining a competitive low cost. To demonstrate the effectiveness of our approach, we designed, fabricated, and tested a completely integrated flow cytometer coupled to a portable media device. The system operation was tested with fluorescent plastic micro-bead solutions ranging from 100 beads/μL to 500 beads/μL. We demonstrated that this hybrid lab-on-a-chip fabrication technology is suitable for producing low-cost and portable biological microsystems and for effectively bridging the gap between new device concepts and their mass production.

A New Process Combining Micro-Electro-Discharge-Machining Milling and Sinking for Fast Fabrication of Microchannels With Draft Angle

A comparison of the machining performance of micro-electro-discharge machining (EDM) milling and sinking is proposed considering the fabrication of microchannels with controlled sloped walls realized in a hardened steel workpiece. Adopting the fine-finishing machining regime for both micro-EDM techniques, the experimental results show that micro-EDM sinking is about ten times faster than milling in the worst case, though a lack of accuracy in the final microfeatures in the former case is detected due to not compensated tool wear. On the contrary, micro-EDM milling provides a better control of the microchannel dimensions. Finally, a microfilter mold for medical applications is machined in order to show the potential of the combination of both technologies.

Imaging cytometry in a plastic ultra-mobile system

We present a cost-effective and highly-portable plastic prototype that can be interfaced with a cell phone to implement an optofluidic imaging cytometry platform. It is based on a PMMA microfluidic chip that fits inside an opto-mechanical platform fabricated by a 3D printer. The fluorescence excitation and imaging is performed using the LED and the CMOS from the cell phone increasing the compactness of the system. A custom developed application is used to analyze the images and provide a value of particle concentration.

Micro-FDM process capability and comparison with micro-injection moulding

In recent years, fused deposition modelling technology (FDM) has become one of the most important additive manufacturing technology due to its capability to produce functional prototypes with complex shape in a cost effective way. Recently, the trend towards miniaturization invested also this technology, since the request of micro-component is rapidly growing due to the increasing number industrial sectors involved. Mechanical properties are fundamental in some sectors of high-quality micro-parts, so the knowledge of the influence of FDM process parameters on mechanical properties can be useful to extend its application and help the optimization of the parameter selection. In this context, the aim of this study is the analysis of the FDM capability and the room for improvement, through a comparison with a well-consolidated industrial process, such as the micro-injection moulding. Although FDM quality cannot compete with the technologies industrially used for final products, its low cost and short time are very attractive for some applications. Moreover, the comparison can be interesting since FDM is often used to manufacture prototypes eventually made with more performing industrial technologies, so that a measure of the quality and functionality of these prototypes can be extremely useful for product developers.In recent years, fused deposition modelling technology (FDM) has become one of the most important additive manufacturing technology due to its capability to produce functional prototypes with complex shape in a cost effective way. Recently, the trend towards miniaturization invested also this technology, since the request of micro-component is rapidly growing due to the increasing number industrial sectors involved. Mechanical properties are fundamental in some sectors of high-quality micro-parts, so the knowledge of the influence of FDM process parameters on mechanical properties can be useful to extend its application and help the optimization of the parameter selection. In this context, the aim of this study is the analysis of the FDM capability and the room for improvement, through a comparison with a well-consolidated industrial process, such as the micro-injection moulding. Although FDM quality cannot compete with the technologies industrially used for final products, its low cost and short time are...

Full-mesh optical backplane with standard MM fiber ribbons

A new optical backplane solution is proposed for high-capacity ICT apparatus. A modular, scalable and full-mesh bandwidth-upgradable optical interconnection between optoelectronic boards is guaranteed thanks to an optimized layout of standard MM 12-fiber ribbons which divides the overall backplane into several independent optical sub-circuits. The novel automated assembly procedure of fiber ribbons inside sub-circuits with a robotic work-cell is described. System validation of the optical backplane performed with commercially available MM 12-fiber transceivers @10Gb/s proved the feasibility of the proposed solution for future optical interconnections with terabit overall capacity.

Design and Development of a Fully Automated Assembly Solution for Optical Backplane Interconnection Circuits

The paper presents the design and development of a new robotized assembly system of optical backplanes in high-capacity ICT (Information and Communication Technology) apparatus, mainly used for switching stations and distribution networks. The optical backplane solution consists of several optical fiber ribbons positioned on a planar backplane according to an innovative and optimized full-mesh layout where the overall optical interconnection is partialized into a plurality of different independent sub-circuits. Each optical interconnection sub-circuit consists of optical fiber ribbons with standardized optical and mechanical interfaces and customized components that have to be carefully and precisely assembled in order to achieve connections with low optical power losses. The paper describes the method and the main devices and tools conceived for the automatic assembly of optical interconnection sub-circuits, highlighting the critical aspects and the proposed solutions towards the automatized assembly of the whole optical backplane.Copyright