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Wae Chet Yong

Infineon Technologies

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Archive | 2007

Semiconductor device including isolation layer

Joachim Mahler; Wae Chet Yong; Stanley Job Doraisamy; Gerhard Deml; Rupert Fischer; Reimund Engl

Archive | 2012

Integrated Semiconductor Outline Package

Stanley Job Doraisamy; Wae Chet Yong

Archive | 2008

Semiconductor devices having a resin with warpage compensated surfaces

Chai Wei Heng; Wae Chet Yong; Stanley Job Doraisamy; Khai Huat Jeffrey Low; Gerhard Deml

Archive | 2005

SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING

Wae Chet Yong; Mohd Fauzi Hj Mahat; Stanley Job Doraisamy; Tien Lai Tan

Archive | 2010

Integriertes Halbleiter-Outline-Gehäuse

Stanley Job Doraisamy; Wae Chet Yong

Archive | 2011

Method of Fabricating A Semiconductor Device Having A Resin With Warpage Compensated Structures

Chai Wei Heng; Wae Chet Yong; Stanley Job Doraisamy; Khai Huat Jeffrey Low; Gerhard Deml

Archive | 2008

Method of Forming Component Package

Soon Hock Tong; Wae Chet Yong; Stanley Job Doraisamy

Archive | 2005

Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing

Wae Chet Yong; Mohd Fauzi Hj Mahat; Stanley Job Doraisamy; Tien Lai Tan

Archive | 2005

A method of manufacturing an electronic component

Khai Huat Jeffrey Low; Chai Wei Heng; Wae Chet Yong

Archive | 2005

Verfahren zum Herstellen eines elektronischen Bauteils A method of manufacturing an electronic component

Khai Huat Jeffrey Low; Chai Wei Heng; Wae Chet Yong

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