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Wang Chong

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Publication

Featured researches published by Wang Chong.

Archive | 2015

Printed circuit board and electrocoppering process thereof

Wang Chong; Zhu Kai; Cheng Jiao; Xiao Dingjun; Liu Binyun; He Wei

Archive | 2015

Method for achieving chemical nickel plating by activating surface of PCB

Lin Jianhui; Wang Chong; He Xuemei; Wang Shouxu; He Wei

Archive | 2017

Method for preparing integrated inductor multi-component composite magnetic core layer

Zhou Guoyun; He Di; He Wei; Li Yongqiang; Wang Shouxu; Chen Yuanming; Wang Chong

Archive | 2017

Inductor structure used for printed circuit board embedding technology and manufacturing method thereof

He Xuemei; He Wei; Chen Yuanming; Wang Shouxu; Zhou Guoyun; Wang Chong; Shen Tao

Archive | 2017

Plating solution for electroplating copper

Cheng Jiao; Liu Binyun; Xiao Dingjun; Zheng Chenmou; Wang Chong

Archive | 2017

Clean production technology of electron-level high-purity copper oxide

Tan Ze; Huang Siping; Zhou Yilang; He Wei; Wang Chong; Lu Haiyan

Archive | 2017

Curing adhesive used for preparation of microsection sample of printed circuit and preparation method thereof

Chen Yuanming; Shen Tao; Wang Shouxu; He Wei; Gao Qingyao; Wen Na; He Xuemei; Wang Chong; Zhou Guoyun

Archive | 2017

Preparation method of sodium gold sulfide solution for cyanide-free gold plating

Tan Ze; Huang Yongrun; Xiao Dingjun; He Wei; Wang Chong; Tao Zhihua

Applied Surface Science | 2017

IC基板のコプレーナ銅ピラーめっきのためのプラズマ表面改質による光抵抗膜表面のぬれ性の改善【Powered by NICT】

Xiang Jing; Wang Chong; Chen Yuanming; Wang Shouxu; Hong Yan; Zhang Huaiwu; Gong Lijun; He Wei

Archive | 2016

Conductive ink and method for preparing printed circuit from conductive ink

He Wei; Li Meijuan; Wang Shouxu; Mao Yingjie; Zhou Guoyun; Chen Yuanming; Yang Wenjun; Wang Chong

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Zhang Huaiwu

University of Electronic Science and Technology of China

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