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Featured researches published by Warren Alan Alpaugh.


Thermochimica Acta | 1974

The thermal properties of monochloro-para-xylylene

Warren Alan Alpaugh; D. R. Morrow

Abstract The three thermal properties that describe the heat transfer in a material were determined for a thin, tough, transparent, highly crystalline film of poly-monochloro-para-xylylene (PCPX). These three properties, viz. thermal conductivity (K), thermal diffusivity (α), and specific heat (Cp) were determined using a transient heating method. The experimental method used involved the heating of a sample of stacked polymer sheets by an ultrathin heating foil. The heating foil, located in the center plane of the stack provided a source of constant heat flux when a current of known amperage was passed through it. By careful consideration of sample dimensions, the sample simulated an infinite solid. The thermal properties were calculated using standard solutions of the heat transfer equations of an infinite solid over a temperature range of −192 to 130°C. The experimental method was repeated to check the reproducibility of the results and compared with differential scanning calorimeter results. A data acquisition system was developed to facilitate data handling for the transient experiments. The system included hardware capable of punching data on paper tape and a software package to analyze these data. The conclusions drawn include: (1) the reproducibility of the experiments was well within the experimental errors; (2) the data acquisition system greatly facilitates acquisition of thermal data; (3) an incremental change occurs in Cp of PCPX in the vicinity of the γ relaxation reported by dynamical relaxation measurements and its occurrence indicates that this relaxation involves a cooperative motion of molecules; (4) owing to the significant magnitude of the Cp jump and the appreciable degree of crystallinity of PCPX, these internal motions occurring at the γ transition probably involve both amorphous and crystalline regions; (5) a direct relationship between thermal expansion and specific heat was indicated in PCPX as well as for polystyrene (PS) at relatively low temperatures (−200 to −20°C); (6) the overall low values of thermal conductivity (1.0 to 2.5 × 10−4 cal sec−1 cm−1) and thermal diffusivity (9.5 to 5.3 × 10−4 cm2 sec−1) of PCPX indicate that it is ideally suited for insulation applications.


Archive | 1995

Method of making printed circuit board

Warren Alan Alpaugh; Voya R. Markovich; Ajit K. Trivedi; Richard Stuart Zarr


Archive | 1993

Printed circuit board or card for direct chip attachment and fabrication thereof

Warren Alan Alpaugh; Voya R. Markovich; Ajit K. Trivedi; Richard Stuart Zarr


Archive | 1978

Electroless copper plating process with dissolved oxygen maintained in bath

Warren Alan Alpaugh; Theodore Daniel Zucconi


Archive | 1980

Treatment of waste compositions

Warren Alan Alpaugh; George Joseph Macur; James Edward Sharkness


Archive | 1975

Method for producing a resin rich epoxy prepreg and laminate

Warren Alan Alpaugh; William J. Summa


Archive | 1984

Deposition of copper from electroless plating compositions

Warren Alan Alpaugh; William Joseph Amelio; Voya R. Markovich; Carlos Juan Sambucetti


Archive | 1977

Cleaning of high aspect ratio through holes in multilayer printed circuit boards

Warren Alan Alpaugh; Michael J. Canestaro; Theron L. Ellis


Archive | 1993

Methyl chloroform-free desmear process in additive circuitization

Warren Alan Alpaugh; Anilkumar Chinuprasad Bhatt; Michael J. Canestaro; Robert J. Day; Edmond Otto Fey; John E. Larrabee


Archive | 1976

Method for preparing substrate surfaces for electroless deposition

Warren Alan Alpaugh; George Joseph Macur; Gary Paul Vlasak

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