Weisheng Lei

Solid state UV laser technology for electronic packaging applications

This presentation introduces solid state UV laser drilling technology for electronic packaging applications which mainly includes generating microvias in high-density interconnects (HDI) printed wiring boards (PWB) and integrated circuit (IC) chip packaging devices. The first three sections discuss the drilling process technology in terms of substrate materials, via quality requirements, laser-materials interaction, via formation processes, laser beam profiles, and system hardware. The remaining sections cover some typical application examples including via drilling, soldermask ablation, and routing to explain the UV laser process capability with the common PWB materials.

Micro-via drilling applications with solid-state harmonic UV laser systems

Micro-via drilling technologies have been implemented in printed circuit board manufacturing industry for high density interconnects and integrated circuit packaging applications and are challenged with ever-tighter requirement in quality, throughput and cost efficiency. This paper reports the current status and progress of the micro-vias drilling applications in this field with solid-state harmonic UV laser drill systems, with emphasis on such issues as UV laser interactions with different materials, quality control and throughput improvement.Micro-via drilling technologies have been implemented in printed circuit board manufacturing industry for high density interconnects and integrated circuit packaging applications and are challenged with ever-tighter requirement in quality, throughput and cost efficiency. This paper reports the current status and progress of the micro-vias drilling applications in this field with solid-state harmonic UV laser drill systems, with emphasis on such issues as UV laser interactions with different materials, quality control and throughput improvement.