Wenjun Zou

Effects of nano-AlN on Phase Transformation of Low Temperature Vitrified Bond during Sintering Process

The effects of nano-AlN and sintering temperature on bending strength and wear resistance of low temperature vitrified bond for diamond grinding tools were studied. Furthermore, the phase transformation during sintering process was investigated by means of thermo-gravimetric analysis (TG), differential thermal analysis (DTA) and X-ray diffraction (XRD). The results show that the higher bending strength and wear resistance of low temperature vitrified bond are obtained by adding nano-AlN in bonds and sintering at optimum temperature. Nano-AlN added in bonds promotes the crystallization during sintering process and refines the grain sizes of crystalline phase.

Investigation of Complexation of Linear Poly(N-vinyl-2-pyrrolidone) with Poly(methacrylic acid-co-methyl methacrylate) Gel

The contraction of poly(methacrylic acid-co-methyl methacrylate) (P(MAA-co-MMA)) gel induced by complexation with linear poly(N-vinyl-2-pyrrolidone) (PVP) is quite different from that of poly(acrylic acid) (PAA) or poly(methacrylic acid) (PMAA) gel. It was found that the concentration of PVP has a strong effect on the complexation with P(MAA-co-MMA) gel. When PVP was introduced into the P(MAA-co-MMA) network, its dynamic mechanic properties vary greatly between complexed and uncomplexed networks. It had the following results: (1) the higher modulus ratio; (2) a slight contraction of gel.

Influence of Sn and Bi Additions on the Structures and Wear Properties of Cu–Sn–P–Ce cBN Tools

In this work Sn and Bi were added to Cu–Sn–P–Ce for improving its microstructures and properties. Structures of the three matrices were investigated by XRD, SEM and EDS. The Cu41Sn11 became the main microstructure with some pores, the grinding ratio increased, and the grinding efficiency improved slightly with the addition of Sn to Cu–Sn–P–Ce. Bi was distributed in the form of simple substance, the grinding ratio increased, and the grinding efficiency greatly reduced with the addition of Bi to Cu–Sn–P–Ce.