Wenting Hou

Defect-reduced green GaInN/GaN light-emitting diode on nanopatterned sapphire

Green GaInN/GaN quantum well light-emitting diode (LED) wafers were grown on nanopatterned c-plane sapphire substrate by metal-organic vapor phase epitaxy. Without roughening the chip surface, such LEDs show triple the light output over structures on planar sapphire. By quantitative analysis the enhancement was attributed to both, enhanced generation efficiency and extraction. The spectral interference and emission patterns reveal a 58% enhanced light extraction while photoluminescence reveals a doubling of the internal quantum efficiency. The latter was attributed to a 44% lower threading dislocation density as observed in transmission electron microscopy. The partial light output power measured from the sapphire side of the unencapsulated nanopatterned substrate LED die reaches 5.2 mW at 525 nm at 100 mA compared to 1.8 mW in the reference LED.

Highly Polarized Green Light Emitting Diode in m-Axis GaInN/GaN

Linearly polarized light emission is analyzed in nonpolar light-emitting diodes (LEDs) covering the blue to green spectral range. In photoluminescence, m-plane GaInN/GaN structures reach a polarization ratio from 0.70 at 460 nm to 0.89 at 515 nm peak wavelength. For a-plane structures, the polarization ratio is 0.53 at 400 nm and 0.60 at 480–510 nm. In electroluminescence the polarization ratio is 0.77 at 505 nm in 350×350 µm2m-plane devices at 20 mA. Such a device should allow 44% power saving compared with nonpolarized c-plane LEDs combined with a polarizing filter, as commonly used in LED-backlit liquid crystal displays.

Evaluation of metal/indium-tin-oxide for transparent low-resistance contacts to p-type GaN.

In search of a better transparent contact to p-GaN, we analyze various metal/indium-tin-oxide (ITO) (Ag/ITO, AgCu/ITO, Ni/ITO, and NiZn/ITO) contact schemes and compare to Ni/Au, NiZn/Ag, and ITO. The metal layer boosts conductivity while the ITO thickness can be adjusted to constructive transmission interference on GaN that exceeds extraction from bare GaN. We find a best compromise for an Ag/ITO (3 nm/67 nm) ohmic contact with a relative transmittance of 97% of the bare GaN near 530 nm and a specific contact resistance of 0.03 Ω·cm2. The contact proves suitable for green light-emitting diodes in epi-up geometry.

Boosting Green GaInN/GaN Light-Emitting Diode Performance by a GaInN Underlying Layer

The light output of 530 nm green GalnN/GaN light-emitting diodes on sapphire has been nearly doubled by the insertion of a 130-nm GalnN underlayer (UL) between the n-GaN electron injection layer and the quantum-well (QW) active region. Under variation of the alloy composition, best results were obtained for an x = 6.3% Ga1-xInxN UL. By low-temperature depth-resolved cathodoluminescence spectroscopy, an interplay of the impurity-related donor-acceptor pair recombination, the UL, and the QW emission has been observed. We propose that the resonance and level alignments between the defect and UL levels reroute excitation toward radiative recombination in the QWs.

Effects of oxygen thermal annealing treatment on formation of ohmic contacts to n-GaN

A contact scheme to undoped and n-type GaN was identified that does not require a post deposition anneal. As-deposited Ti/Al/Ti/Au usually forms a Schottky contact. However, we find that by means of an oxygen rapid thermal annealing prior to metal deposition, the contact will develop an ohmic behavior with a specific contact resistance of 3.8 × 10−5 Ω cm2. In X-ray photoelectron spectroscopy, we find that the Ga 3 d electron binding energy increases with this pre-treatment, indicating a shift of the Fermi level closer to the conduction band. This sequence reversion of high temperature processing steps allows important gain in device fabrication flexibility.

Green LED development in polar and non-polar growth orientation

The green spectral region provides a formidable challenge for energy efficient light emitting diodes. In metal organic vapor phase epitaxy we developed GaInN/GaN quantum well material suitable for 500 - 580 nm LEDs by rigorous defect reduction and thrive for alloy uniformity. We achieve best results in homoepitaxy on polar c-plane, and non-polar a-plane and m-plane bulk GaN. By the choice of crystal orientation, the dipole of piezoelectric polarization in the quantum wells can be optimized for highest diode efficiency. We report progress towards the goal of reduced efficiency droop at longer wavelengths.

Non-polar GaInN-based light-emitting diodes: an approach for wavelength-stable and polarized-light emitters

In absence of piezoelectric polarization along the growth axis, a- and m-plane green GaInN light emitting diodes manifest stable emission wavelength -- independent of the injection current density. The shift of the dominant wavelength is less than 8 nm when varying the forward current density from 0.1 to 38 A/cm2. Furthermore, the light emitted from the growth surface of such non-polar structures shows a very degree of linear polarization. This is attributed to a strong valance band splitting in such anisotropically strained wurtzite GaInN quantum wells . Such light emitting diodes show a high potential for energy efficient display applications.

INTEGRATION OF N- AND P-CONTACTS TO GaN-BASED LIGHT EMITTING DIODES

Low-resistance Ohmic contacts are essential for the fabrication of electrical devices. While low contact resistance has been achieved to p-type layers or n-type layers separately, contacts are likely to degrade when both types need to be integrated into a single fabrication process, in particular when prior mesa etching is required. We present a solution to the problem, resulting in low-resistance Ohmic contacts on n-type GaN layers without post-deposition thermal anneal, while maintaining the quality of typical p-type contacts. We implement an integrated process for both, n- and p-contacts, involving an oxygen pretreatment to fabricate light emitting diodes with lower series resistance in the contacts and lower voltage drop at high current when compared to separately optimized contacts.

HOW DO WE LOSE EXCITATION IN THE GREEN

Efficiency droop and green gap are terms that summarize performance limitations in GaInN/GaN high brightness light emitting diodes (LEDs). Here we summarize progress in the development of green LEDs and report on time resolved luminescence data of polar c-plane and non-polar m-plane material. We find that by rigorous reduction of structural defects in homoepitaxy on bulk GaN and V-defect suppression, higher efficiency at longer wavelengths becomes possible. We observe that the presence of donor acceptor pair recombination within the active region correlates with lower device performance. To evaluate the aspects of piezoelectric polarization we compare LED structures grown along polar and non-polar crystallographic axes. In contrast to the polar material we find single exponential luminescence decay and emission wavelengths that remain stable irrespective of the excitation density. Those findings render high prospects for overcoming green gap and droop in non-polar homoepitaxial growth.