Weon Ho Shin

Dense dislocation arrays embedded in grain boundaries for high-performance bulk thermoelectrics

Squeezing out efficient thermoelectrics Thermoelectric materials hold the promise of converting waste heat into electricity. The challenge is to develop high-efficiency materials that are not too expensive. Kim et al. suggest a pathway for developing inexpensive thermoelectrics. They show a dramatic improvement of efficiency in bismuth telluride samples by quickly squeezing out excess liquid during compaction. This method introduces grain boundary dislocations in a way that avoids degrading electrical conductivity, which makes a better thermoelectric material. With the potential for scale-up and application to cheaper materials, this discovery presents an attractive path forward for thermoelectrics. Science, this issue p. 109 Pressure-assisted liquid-phase compaction allows synthesis of high–conversion efficiency thermoelectric materials. The widespread use of thermoelectric technology is constrained by a relatively low conversion efficiency of the bulk alloys, which is evaluated in terms of a dimensionless figure of merit (zT). The zT of bulk alloys can be improved by reducing lattice thermal conductivity through grain boundary and point-defect scattering, which target low- and high-frequency phonons. Dense dislocation arrays formed at low-energy grain boundaries by liquid-phase compaction in Bi0.5Sb1.5Te3 (bismuth antimony telluride) effectively scatter midfrequency phonons, leading to a substantially lower lattice thermal conductivity. Full-spectrum phonon scattering with minimal charge-carrier scattering dramatically improved the zT to 1.86 ± 0.15 at 320 kelvin (K). Further, a thermoelectric cooler confirmed the performance with a maximum temperature difference of 81 K, which is much higher than current commercial Peltier cooling devices.

Cu–Bi–Se-based pavonite homologue: a promising thermoelectric material with low lattice thermal conductivity

Pavonite homologues, Cux+yBi5−ySe8 (1.2 ≤ x ≤ 1.5, 0.1 ≤ y ≤ 0.4), in a polycrystalline bulk form have been synthesized using a conventional solid state sintering technique. Their thermal and electronic transport properties were evaluated for mid-temperature thermoelectric power generation applications. Structural complexity, based on unique substitutional and interstitial Cu atoms in the structure, makes this system attractive as an intrinsic low thermal conductivity material; also the band structure calculations revealed that interstitial Cu atoms generate n-type carrier conduction. Room temperature lattice thermal conductivities ranging between 0.41 W m−1 K−1 and 0.55 W m−1 K−1 were found for Cux+yBi5−ySe8; these values are comparable to those of the state-of-the-art low lattice thermal conductivity systems. These extremely low thermal conductivities combined with the power factors result in the highest ZT = 0.27 at 560 K for Cu1.9Bi4.6Se8.

Novel Flexible Transparent Conductive Films with Enhanced Chemical and Electromechanical Sustainability: TiO2 Nanosheet–Ag Nanowire Hybrid

Flexible transparent conductive films (TCFs) of TiO2 nanosheet (TiO2 NS) and silver nanowire (Ag NW) network hybrid were prepared through a simple and scalable solution-based process. The as-formed TiO2 NS-Ag NW hybrid TCF shows a high optical transmittance (TT: 97% (90.2% including plastic substrate)) and low sheet resistance (Rs: 40 Ω/sq). In addition, the TiO2 NS-Ag NW hybrid TCF exhibits a long-time chemical/aging and electromechanical stability. As for the chemical/aging stability, the hybrid TCF of Ag NW and TiO2 NS reveals a retained initial conductivity (ΔRs/Rs < 1%) under ambient oxidant gas over a month, superior to that of bare Ag NW (ΔRs/Rs > 4000%) or RuO2 NS-Ag NW hybrid (ΔRs/Rs > 200%). As corroborated by the density functional theory simulation, the superb chemical stability of TiO2 NS-Ag NW hybrid is attributable to the unique role of TiO2 NS as a barrier, which prevents Ag NWs chemical corrosion via the attenuated adsorption of sulfidation molecules (H2S) on TiO2 NS. With respect to the electromechanical stability, in contrast to Ag NWs (ΔR/R0 ∼ 152.9%), our hybrid TCF shows a limited increment of fractional resistivity (ΔR/R0 ∼ 14.4%) after 200 000 cycles of the 1R bending test (strain: 6.7%) owing to mechanically welded Ag NW networks by TiO2 NS. Overall, our unique hybrid of TiO2 NS and Ag NW exhibits excellent electrical/optical properties and reliable chemical/electromechanical stabilities.

Enhancing Thermoelectric Performances of Bismuth Antimony Telluride via Synergistic Combination of Multiscale Structuring and Band Alignment by FeTe2 Incorporation

It has been a difficulty to form well-distributed nano- and mesosized inclusions in a Bi2Te3-based matrix and thereby realizing no degradation of carrier mobility at interfaces between matrix and inclusions for high thermoelectric performances. Herein, we successfully synthesize multistructured thermoelectric Bi0.4Sb1.6Te3 materials with Fe-rich nanoprecipitates and sub-micron FeTe2 inclusions by a conventional solid-state reaction followed by melt-spinning and spark plasma sintering that could be a facile preparation method for scale-up production. This study presents a bismuth antimony telluride based thermoelectric material with a multiscale structure whose lattice thermal conductivity is drastically reduced with minimal degradation on its carrier mobility. This is possible because a carefully chosen FeTe2 incorporated in the matrix allows its interfacial valence band with the matrix to be aligned, leading to a significantly improved p-type thermoelectric power factor. Consequently, an impressively high thermoelectric figure of merit ZT of 1.52 is achieved at 396 K for p-type Bi0.4Sb1.6Te3-8 mol % FeTe2, which is a 43% enhancement in ZT compared to the pristine Bi0.4Sb1.6Te3. This work demonstrates not only the effectiveness of multiscale structuring for lowering lattice thermal conductivities, but also the importance of interfacial band alignment between matrix and inclusions for maintaining high carrier mobilities when designing high-performance thermoelectric materials.