Wieslaw Sabat

The design concept of system integration based on heterostructure

This study shows technological realization of heterostructure LTCC structure - HTCC substrate. Heterostructure realization results are analyzed regarding the application of LTCC ceramics and HTCC substrates where possible solution is local heat dissipation from power elements. Technological solution has been applied during the 3D integrations of mobile mini-machine control electronics in a System on Module (SoM) assembly.

Influence of geometrical parameters of mutual parallel paths on process of disturbances propagation

The problems connected with electromagnetic couplings between mutual parallel paths in planar structures made in thick-film technology have been presented in the paper. The influence of geometrical configuration of thick-film path systems on shape of transfer function between them has been analyzed. The modification of transfer function under changes of the particular geometrical factors has been quantitatively determined using elaborated computer programs. The results of calculations have been presented for the selected path configurations.

Application of operational method in analysis of electromagnetic couplings in mutual coupled path systems of planar structures

The application of operational method for analysis of disturbances propagation process in frequency domain in mutual coupled path systems of planar structures has been presented in this paper. The suitable algorithms and their practical realizations in Mathcad program have been elaborated based on literature information. For verification of procedures the test circuits of conductive paths on ceramic substrates have been made in thick-film technology. The results of calculations and measurements (in time and frequency domain) have been presented for selected paths configuration.

Bent multilayer LTCC modules for sensor applications

The potential of Low Temperature Cofired Ceramic (LTCC) multilayer technology allows to realize different structures for sensor applications. Examples of sensors realized at the Department of Hybrid Microelectronics Technical University in Kosice have shown the quality of being potential or the possibility of developing of LTCC for wide field of thick film sensor applications and for bent multi-layer LTCC modules and their application in thick film pressure sensors. LTCC is a technology suitable for design flexibility comparing with conventional thick film, thin film and high-temperature cofired technologies in electronics. Authors of this paper introduced the concept of using the bent multi-layer LTCC modules in unconventionally shaped electronic devices or in the field of sensors.