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William C. Allison

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Publication

Featured researches published by William C. Allison.

Archive | 2010

Cmp pad with local area transparency

William C. Allison; Ping Huang; Diane Scott; Richard Frentzel; Robert Kerprich

Archive | 2015

POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER

William C. Allison; Diane Scott; Paul Andre Lefevre; James P. LaCasse; Alexander William Simpson

Archive | 2010

Soft polishing pad for polishing a semiconductor substrate

William C. Allison; Diane Scott; Robert Kerprich; Ping Huang; Richard Frentzel

Archive | 2012

Polishing pad with homogeneous body having discrete protrusions thereon

Rajeev Bajaj; Ping Huang; Robert Kerprich; William C. Allison; Richard Frentzel; Diane Scott

Archive | 2013

Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer

Paul Andre Lefevre; William C. Allison; James P. LaCasse; Diane Scott; Alexander William Simpson; Ping Huang; Leslie M. Charns

Archive | 2015

POLISHING PAD WITH ALIGNMENT FEATURE

Robert Kerprich; William C. Allison; Diane Scott

Archive | 2012

Polishing pad with concentric or approximately concentric polygon groove pattern

William C. Allison; Diane Scott; Alexander William Simpson

Archive | 2014

POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS

Ping Huang; Diane Scott; James P. LaCasse; William C. Allison

Archive | 2013

Polishing pad for eddy current end-point detection

William C. Allison; Diane Scott; Ping Huang; Richard Frentzel; Alexander William Simpson

Archive | 2014

Polishing pad having polishing surface with continuous protrusions having tapered sidewalls

Paul Andre Lefevre; William C. Allison; Alexander William Simpson; Diane Scott; Ping Huang; Leslie M. Charns; James Richard Rinehart; Robert Kerprich

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