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Dive into the research topics where William J. Schultz is active.

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Featured researches published by William J. Schultz.


Journal of Adhesion | 1993

Elastomers Formed In-Situ in Epoxy Resins: Chemistry and Toughening

Alphonsus V. Pocius; William J. Schultz; Wendy L. Thompson; Randall A. Adam

Abstract The chemistry of the in-situ formation of elastomer particles in epoxy resins is described. Under normal synthetic conditions, if one polymerizes an acrylic monomer in an epoxy resin, the resulting polymer is soluble in the epoxy resin or it grossly phase separates, depending upon the solubility parameter difference between the acrylic polymer and the epoxy resin. This work shows that with the use of a specifically tailored material (which we believe operates as a “polymeric surfactant”) in the reaction mixture, a free-flowing, stable suspension of acrylic elastomer particles in epoxy resin can be obtained. Thus, the reaction product of isocyanatoethylmethacrylate and EPONTM 1009 can be used as the polymeric surfactant in a reaction mixture containing hexyl acrylate, azo-bis(isobutyronitrile) and the diglycidyl ether of bisphenol A. The resulting dispersion is stable to settling even after exposure to 150°C. When properly formulated, the resulting modified epoxy resins are improved in their fract...


Archive | 1995

Curable resin sols and fiber-reinforced composites derived therefrom

Douglas P. Goetz; Andrew M. Hine; William J. Schultz; Wendy L. Thompson


Archive | 1997

Dental visible light curable epoxy system with enhanced depth of cure

David A. Kaisaki; Sumita B. Mitra; William J. Schultz; Robert J. DeVoe


Archive | 2008

Light extraction film with nanoparticle coatings

Jun-Ying Zhang; Jimmie R. Baran; Terry L. Smith; William J. Schultz; William Blake Kolb; Cheryl A. Patnaude; Sergey A. Lamansky; Brian K. Nelson; Naiyong Jing; Brant U. Kolb


Archive | 2003

Nanoparticle filled underfill

Scott B. Charles; Kathleen M. Gross; Steven C. Hackett; Michael A. Kropp; William J. Schultz; Wendy L. Thompson


Archive | 2001

Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents

Theary Chheang; Andrew M. Hine; Mark W. Muggli; Susan C. Noe; Patricia M . Sanft; William J. Schultz; Robert D. Taylor; Stanley F . Tead


Archive | 1986

Epoxy resin curing agent, process, and composition

William J. Schultz; Gene B. Portelli; Jeffrey P. Minnesota Mining Tane


Archive | 1990

Epoxide resin compositions and method

Carl J. Almer; William J. Schultz


Journal of the American Chemical Society | 1980

A new family of cation-binding compounds: threo-.alpha.,.omega.-poly(cyclooxalkane)diyl

William J. Schultz; Margaret C. Etter; Alphonsus V. Pocius; Samuel Smith


Archive | 1995

Thermoplastic polymer particles in liquid thermosettable resin

Gene B. Portelli; William J. Schultz; John T. Boden; Daniel M. Kaufer

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