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Dive into the research topics where Winco K.C. Yung is active.

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Featured researches published by Winco K.C. Yung.


Journal of Engineering Design | 2011

A life-cycle assessment for eco-redesign of a consumer electronic product

Winco K.C. Yung; Hing Kai Chan; Joey H.T. So; Danny W.C. Wong; Albert C.K. Choi; T.M. Yue

Life-cycle assessment (LCA) regarding personal electronic products receives little attention, probably due to the fact that most of them are compact in size; hence, the environmental impact per unit is relatively lightweight. In this connection, how to perform eco-design for electronic products in practice with respect to all phases of their life cycle is unclear. However, taking their total (annual) consumption into consideration, the total impact cannot be underestimated. The main objective of this paper is to fill this gap by analysing a personal electronic product from the eco-design point of view. The results are presented in terms of different environmental aspects (like emissions to air) and associated suggestions for eco-redesign. More specifically, this paper aims to: (i) reveal a case study in which LCA is applied to an electronic product. The focus is on how to collect relevant data in this regard; (ii) summarise the results in terms of a variety of environmental impacts so that key items or key issues can be identified and quantified accordingly and (iii) suggest a set of associated eco-redesign options responding to the aforementioned issues. Improvement of the new design is then compared with the original design.


International Journal of Operations & Production Management | 1997

The values of TQM in the revised ISO 9000 quality system

Winco K.C. Yung

Assesses the latest revisions to the ISO 9000 quality system, which seek to embrace the principles of total quality management (TQM) more closely. Highlights some of the TQM elements introduced into the system, such as: quality improvement; management commitment with a greater emphasis on executive roles; operational processes showing linkages to the overall system; and customer satisfaction. Compares the advantages and disadvantages of the two systems and discusses the practicality of the revised ISO 9000 system as a highway to TQM.


Microelectronics Reliability | 2009

Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages

Asit Kumar Gain; Y.C. Chan; Ahmed Sharif; N.B. Wong; Winco K.C. Yung

a b s t r a c t Sn-9Zn solder joints containing Ag nano particles were prepared by mechanically mixing Ag nano parti- cles (0.3, 0.5 and 1 wt%) with Sn-9Zn solder paste. In the monolithic Sn-Zn solder joints, scallop-shaped AuZn 3 intermetallic compound layers were found at their interfaces. However, after the addition of Ag nano particles, an additional uniform AgZn 3 intermetallic compound layer well adhered to the top surface of the AuZn 3 intermetallic compound layer was found. In addition, in the solder ball region, fine spher- ical-shaped AgZn 3 intermetallic compound particles were observed as well as Zn-rich and b-Sn phases. With the addition of Ag nano particles, the shear strengths consistently increased with an increase in the Ag nano particle content due to the uniform distribution of fine AgZn 3 intermetallic compound par- ticles. The shear strength of monolithic Sn-Zn and 1 wt% Ag nano particle content Sn-Zn solder joints after one reflow cycle were about 42.1 MPa and 48.9 MPa, respectively, while their shear strengths after eight reflow cycles were about 39.0 MPa and 48.4 MPa, respectively. The AgZn 3 IMCs were found to be uniformly distributed in the b-Sn phase for Ag particle doped Sn-9Zn composite solder joints, which result in an increase in the tensile strength, due to a second phase dispersion strengthening mechanism. The fracture surface of monolithic Sn-Zn solder exhibited a brittle fracture mode with a smooth surface while Sn-Zn solder joints containing Ag nano particles showed a typical ductile failure with very rough dimpled surfaces.


Journal of Materials Processing Technology | 1997

An investigation into welding parameters affecting the tensile properties of titanium welds

Winco K.C. Yung; Brian Ralph; W. B. Lee; R. Fenn

Abstract Grain size and amount of martensite formation affect the tensile strength of the alloy and these two factors are in turns related to the cooling rate of the welding process. There was found a trend of decreased tensile strength with the increase of welding heat input and a trend of increased tensile strength with the increase of welding cooling rate. Considering the effect of cooling rate on ductility, it was found that the higher the cooling rate, the larger is the relative elongation and hence the higher the welds ductility.


Microelectronics Reliability | 2010

Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads

Tama Fouzder; Asit Kumar Gain; Y.C. Chan; Ahmed Sharif; Winco K.C. Yung

Abstract Nano-sized, nonreacting, noncoarsening Al 2 O 3 particles have been incorporated into eutectic Sn–Zn solder alloys to investigate the microstructure, hardness and shear strength on Au/Ni metallized Cu pads ball grid array substrate (BGA). In the plain Sn–Zn solder joint and solder joints containing Al 2 O 3 nano-particles, a scallop-shaped AuZn 3 intermetallic compound layer was found at the interfaces. In the solder joints containing Al 2 O 3 nano-particles, a fine acicular-shaped Zn-rich phase and Al 2 O 3 nano-particles were found to be homogeneously distributed in the β-Sn matrix. The shear strengths and hardness of solder joints containing higher percentage of Al 2 O 3 nano-particles exhibited consistently higher value than those of plain solder joint and solder joints containing lower percentage of Al 2 O 3 nano-particles due to control the fine microstructure as well as homogeneous distribution of Al 2 O 3 nano-particles acting as a second phase dispersion strengthening mechanism. The fracture surfaces of plain Sn–Zn solder joints exhibited a brittle fracture mode with smooth surfaces while Sn–Zn solder joints containing Al 2 O 3 nano-particles showed a typical ductile failure with very rough dimpled surfaces.


International Journal of Operations & Production Management | 2003

Application of value delivery system (VDS) and performance benchmarking in flexible business process reengineering

Winco K.C. Yung; Danny Ting‐Hong Chan

The new management concept of flexible business process reengineering (FBPR) may be defined as a methodology that combines the best of three management tools – positioning, continuous improvement and business process reengineering (PIR). Employing all three management tools to a sufficient degree could enhance the effectiveness of an improvement project compared to the conventional BPR methodology. The changes could be slightly less “radical” than conventional BPR, but in exchange, it is a relatively less risky strategy and can facilitate continuous learning and improvement. To maximize the organizations competitiveness through the application of FBPR, it is important to establish a value delivery system (VDS) to increase the projects effectiveness and to employ performance benchmarking to determine the performance gap. Using a case study, this paper illustrates the essentiality and the application of VDS and performance benchmarking during the implementation of FBPR.


Journal of Materials Processing Technology | 1996

An integrated model for manufacturing process improvement

Winco K.C. Yung

Abstract In order to survive in a competitive market, improving quality and profitability of products seem to be the only way. Some simple techniques like Statistical Process Control (SPC) and the seven basic tools are valuable and effective for this objective. Simple as they are, their benefits in process improvement have not been fully realized due to the lacking of an integrated approach. This paper presents a case study in which a local Printed Circuit Board (PCB) fabrication company employs very simple techniques (e.g. SPC and seven basic tools etc.) to significantly improve both product and process quality and productivity. At the same time, it verified the intimate relationship between SPC, the seven basic tools, KAIZEN and Total Quality Management (TQM) principles, which should be integrated in practice. Statistical Process Control (SPC) was proved to be an effective means to improve quality and productivity; while the basic seven tools are powerful for problem solving. However, to make them successful and effective tools for process and quality improvement, strong commitment from top management and an overwhelming desire for ever-improving quality (i.e. Kaizen philosophy) is a must.


Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture | 2008

An environmental assessment framework with respect to the Requirements of Energy-using Products Directive

Winco K.C. Yung; Hing Kai Chan; Albert C.K. Choi; T.M. Yue; M I Mazhar

From August 2007, all member states of the European Union are required to enforce a new directive, 2005/32/EC, that affects any products that rely on any forms of energy as the source for operation. These products are referred to as energy-using products (EuPs), and the said directive (EuP directive) aims to achieve a higher level of environmental benefits by considering the environmental impacts throughout their whole life cycle. The EuP directive sets out to establish an outline for the eco-design requirements for EuPs. In this regard, environmental assessment, or more specifically life-cycle assessment, is the most fundamental tool to help manufacturers comply with the directive. This paper aims to discuss the background of the EuP directive and to propose a framework for assessment with respect to the directive, based on a pilot study with four products. One of these four products will be employed to demonstrate the application of the framework.


Journal of Materials Chemistry C | 2015

Eye-friendly reduced graphene oxide circuits with nonlinear optical transparency on flexible poly(ethylene terephthalate) substrates

Winco K.C. Yung; Guijun Li; Hai Ming Liem; H.S. Choy; Zhixiang Cai

The selective reduction of graphene oxide (GO) with direct laser writing is a rapid and efficient process to pattern conductive tracks for flexible electronic circuit applications. Here we report novel eye-friendly reduced graphene oxide (rGO) conductive tracks on transparent and flexible poly(ethylene terephthalate) (PET) substrates synthesized by one-step laser reduction of graphene oxide in an ambient environment. Resistivity as low as 1.07 × 10−4 μm has been achieved for a 20 nm thick rGO film after the industrial-grade 1064 nm Nd:YAG laser treatment. Fingerprints of the synthesized rGO were verified by Raman spectroscopy with an increased intensity ratio of the 2D band over the G band, and the deoxygenation results were examined using both X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FTIR) characterization. The rGO synthesized by this infrared laser reduction showed increased absorption toward a shorter wavelength of up to 96% in UV regions, which can significantly protect human eyes from high energy light hazards. Electronic circuit tracks with rGO synthesized with this 1064 nm laser patterning process can provide novel methods for the fabrication of future eye-friendly flexible electronics with nonlinear optical transparency.


International Journal of Production Research | 2012

Eco-redesign of a personal electronic product subject to the energy-using product directive

Winco K.C. Yung; Hing Kai Chan; Danny W.C. Wong; Joey H.T. So; Albert C.K. Choi; T.M. Yue

It cannot be denied that environmental consciousness is becoming important. Ironically, legislation is probably the most satisfactory driver for pushing manufacturers to take environmental concerns into design considerations. In fact, the European Union introduced a new law (directive 2005/32/EC) for regulating the environmental consequences of all energy-using products (EuPs) in August 2007, the scope of which covers all products that rely on energy sources in any form for operation. Design alternatives are required in the product development stage so that environmental concerns can be considered as a decision parameter. In complying with the directive, life-cycle assessment (LCA) is a useful tool to draw conclusions and to compare the performance of alternatives. In this connection, a case study is carried out to assess the environmental impact of a personal electronic product through LCA, subject to the scope of the stated directive. The objectives of this paper are threefold: (i) to report the case in relation to the directive; (ii) to summarise the results of the LCA accordingly; and (iii) to suggest a new conceptual design and to compare the LCA of this new design with the original design.

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Y.C. Chan

City University of Hong Kong

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Asit Kumar Gain

University of New South Wales

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Ahmed Sharif

Bangladesh University of Engineering and Technology

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Karpagam Subramanian

Hong Kong Polytechnic University

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T.M. Yue

Hong Kong Polytechnic University

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Tama Fouzder

City University of Hong Kong

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Albert C.K. Choi

Hong Kong Polytechnic University

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Hing Kai Chan

The University of Nottingham Ningbo China

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Danny W.C. Wong

Hong Kong Polytechnic University

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Guijun Li

Hong Kong Polytechnic University

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