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Wolfgang Hetzel

Infineon Technologies

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Publication

Featured researches published by Wolfgang Hetzel.

Archive | 2003

Electronic device having a stack of semiconductor chips and method for the production thereof

Wolfgang Hetzel; Anton Legen; Jochen Thomas

Archive | 2003

Stack arrangement of a memory module

Jochen Thomas; Wolfgang Hetzel

Archive | 2006

Semiconductor component comprising an interposer substrate and method for the production thereof

Wolfgang Hetzel; Jochen Thomas; Peter Weitz; Ingo Wennemuth

Archive | 2004

Multi-chip ball grid array package and method of manufacture

Fung Leng Chen; Seong Kwang Brandon Kim; Wee Lim Cha; Yi-Sheng Anthony Sun; Wolfgang Hetzel; Jochen Thomas

Archive | 2003

Method for manufacturing a stack arrangement of a memory module

Jochen Thomas; Wolfgang Hetzel; Ingo Wennemuth

Archive | 2003

Electronic component having stacked semiconductor chips in parallel, and a method for producing the component

Wolfgang Hetzel; Jochen Thomas

Archive | 2005

Halbleiterbauteil mit einem umverdrahtungssubstrat und verfahren zur herstellung desselben

Wolfgang Hetzel; Jochen Thomas; Peter Weitz; Ingo Wennemuth

Archive | 2002

Elektronisches Bauteil mit einem Stapel aus Halbleiterchips und Verfahren zur Herstellung desselben

Wolfgang Hetzel; Anton Legen; Jochen Thomas

Archive | 2005

Stackable single package and stacked multi-chip assembly

Werner Reiss; Wolfgang Hetzel

Archive | 2002

Electronic component for high performance memory chips, has stack of semiconductor chips with wiring layer between chips to connect contact surfaces

Wolfgang Hetzel; Anton Legen; Jochen Thomas

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Collaboration

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Jochen Thomas

Infineon Technologies

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Ingo Wennemuth

Infineon Technologies

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Peter Weitz

Infineon Technologies

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Anton Legen

Infineon Technologies

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Werner Reiss

Infineon Technologies

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Thomas Jochen

Infineon Technologies

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Florian Ammer

Qimonda

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Anthony Sun Yi-Sheng

Infineon Technologies

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Brandon Kim Seong Kwang

Infineon Technologies

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Cha Wee Lim

Infineon Technologies

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