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Featured researches published by Woo Seok Chin.


Journal of Adhesion Science and Technology | 2003

Piezoelectric monitoring of the reliability of adhesive joints

Jae Wook Kwon; Woo Seok Chin; Dai Gil Lee

Since the reliability of adhesively bonded joints for composite structures is dependent on many parameters such as the shape and dimensions of joints, type of applied load, and environment, so an accurate estimation of the fatigue life of adhesively bonded joints is seldom possible, which necessitates an in-situ reliability monitoring of the joints during the operation of structures. In this study, a self-sensor method for adhesively bonded joints was devised, in which the adhesive used works as a piezoelectric material to send changing signals depending on the integrity of the joint. In order to validate the method, the piezoelectric properties of the adhesive were measured during the fatigue test. Electrically conducting adherends were used as electrodes without embedded sensors, and the adhesively bonded joint was modeled as the equivalent parallel circuit composed of electric charge and capacitance. From the investigation, it was found that the electric charge increased gradually as cracks initiated and propagated in the adhesive layer, and had its maximum value when the adhesively bonded joint failed. So it is feasible to monitor the integrity of the joint during its lifetime. Finally, a relationship between the piezoelectric property of the adhesive and crack propagation was obtained from the experimental results.


Composite Structures | 2002

Repair of underground buried pipes with resin transfer molding

Dai Gil Lee; Woo Seok Chin; Jae Wook Kwon; Ae Kwon Yoo

Abstract Repairing and replacing of worn-out underground pipes, such as sewer pipes, water-supply pipes, gas pipes, and communication cables by excavating not only cause traffic congestion but also produce large amount of waste. Also, the operation requires heavy equipments and longer operating time and high cost. In this study, the repairing–reinforcing process of underground pipes with glass fiber fabric polymer composites using resin transfer molding (RTM) which overcomes the problems of present trenchless technologies has been developed. The developed process requires shorter operation time and lower cost with smaller and simpler operating equipments than conventional trenchless technologies. For the faultless operation, a simple method to apply pressure and vacuum to the reinforcement was developed. The resin wetting and void removal during RTM process for very large and long-composite buried pipes were experimentally investigated, and the efficient void removal method was suggested. Cure status and resin filling were monitored with a commercial dielectrometry cure monitoring system, LACOMCURE. From the investigation, it has been found that the developed repair technology with appropriate process parameters and on-line cure monitoring has many advantages over conventional methods.


Journal of Adhesion Science and Technology | 2003

In situ cure monitoring of adhesively bonded joints by dielectrometry

Jae Wook Kwon; Woo Seok Chin; Dai Gil Lee

Since the reliability of adhesively bonded joints is much dependent on the curing status of thermosetting adhesives, the in situ cure monitoring during the cure of adhesive joints could improve the quality of adhesively bonded joints as it enables one to control the cure parameters. In this work, a dielectric method which measures the dissipation factor of the adhesive during the cure of joints and converts it into the degree of cure of the adhesive was devised. Steel adherends were used for the adhesively bonded joints because the steel adherends worked as the electrodes for the measurement of dissipation factor without additional electrodes. The relation between the dissipation factor and the degree of cure of adhesive was investigated, which could eliminate the temperature effect on the dissipation factor that is largely affected by the degree of cure and temperature of adhesive. Comparing the results obtained by the method developed with those by DSC (differential scanning calorimetry), it was found that the dissipation factor showed a trend similar to the cure rate of the adhesive.


Journal of Composite Materials | 2003

Trenchless repairing of underground pipes using RTM based on the axiomatic design method

Woo Seok Chin; Jae Wook Kwon; Dai Gil Lee

To overcome the problems of excavation technology for repairing damaged underground pipes, such as sewer pipes, various trenchless (excavation free or no-dig) technologies has been proposed and tried, but they have some drawbacks such as high cost and inconvenience of operation. In this study, the rehabilitation process of underground pipes with glass fiber fabric polymer composites using Resin Transfer Molding (RTM), which overcomes the problems of present trenchless technologies has been developed through the axiomatic design approach. For the reliable and faultless operation, all the problems and situations that may occur during the real construction has been taken into account at every stage of the design process. The developed process requires shorter operation time and lower cost with smaller and simpler operating equipments than conventional trenchless technologies. From the investigation, it has been found that the developed repair technology with appropriate process parameters determined by design axioms has many advantages over conventional methods.


Composite Structures | 2007

Development of the composite RAS (radar absorbing structure) for the X-band frequency range

Woo Seok Chin; Dai Gil Lee


Composite Structures | 2004

Characterization of electromagnetic properties of polymeric composite materials with free space method

Il Sung Seo; Woo Seok Chin; Dai Gil Lee


Composite Structures | 2006

Binary mixture rule for predicting the dielectric properties of unidirectional E-glass/epoxy composite

Woo Seok Chin; Dai Gil Lee


Composite Structures | 2006

EM characteristics of the RAS composed of E-glass/epoxy composite and single dipole FSS element

Po Chul Kim; Woo Seok Chin; Dai Gil Lee; Il Sung Seo


Composite Structures | 2007

Laminating rule for predicting the dielectric properties of E-glass/epoxy laminate composite

Woo Seok Chin; Dai Gil Lee


Composite Structures | 2005

Development of the trenchless rehabilitation process for underground pipes based on RTM

Woo Seok Chin; Dai Gil Lee

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