Xiaobai Chen

The Study on Magnetron Sputtering Rate of Metal Targets

The sputtering rate of Pt, Au, Fe and Co targets was researched and they were 0.059 nm/s, 0.076 nm/s, 0.050 nm/s, and 0.030nm/s respectively. A series of magnetic multilayers were prepared using the calibrated rate and the anomalous hall effect of the samples were tested, and Hall curve was in line with expectations. The sputtering rate of Pt, Au, Fe and Co targets was appropriate for sample preparation. Suitable sputtering rate play a decisive role in sample preparation.

Structure of Ni80Fe20 Films Deposited on SiO2/Si(100) by Direct Current Magnetron Sputtering System with the Oblique Target

About 300nm-thick Ni80Fe20 films were deposited on SiO2/Si (100) substrates at 300 K and 673 K in 1.2 Pa and 0.8 Pa Ar gas by a direct current (DC) magnetron sputtering system with the oblique target. The films grown at 300 K have a predominate [11 crystal orientation in the growth direction whereas those deposited at 673 K grow mainly with a [11 crystalline orientation in the growth direction. All the films have a columnar structure. The grain size increases with increasing deposition temperature. The films grown at 673 K are dense compared with those grown at 300 K. The film deposited at 673 K in 0.8 Pa Ar has the lowest resistivity.