Xiaobing Luo

Experimental Research on a Honeycomb Microchannel Cooling System

A honeycomb porous microchannel cooling system for cooling electronics is proposed in this paper. The design, fabrication, and test system configuration of the microchannel heat sink are presented. Experiments were conducted to determine the heat transfer characteristics and cooling performance of this microchannel cooling system under steady single-phase flow of water. In the experiments, a brass microchannel heat sink was attached to a test heater with 8 cm2 area. The heat transfer capabilities of the cooling system with different amounts of input heating power, different system designs, and various levels of pumping power were evaluated. The experimental results show that the designed cooing system performs well. For a heat sink design using double inlets and outlets, the system is able to remove a heat flux of 17.6 W/cm2 under 0.72 W of pumping power, with the heater wall temperature of 61.4°C and the ambient temperature of 17.8°C. When the heat flux decreases to 9.4 W/cm2 with the other conditions remaining the same, the heater substrate temperature is 42.4°C. It is also clear from the experiments that the heat source temperatures are very uniform when cooled by the present system, which is important for many applications requiring high thermal reliability. As the pumping power and system flow rate increase, the heat source temperature sharply decreases. A heat flux of 18.2 W/cm2 can be removed under 2.4-W pumping power when the heat source temperature is 48.3°C and the ambient temperature is 14.9°C.

A Honeycomb Microchannel Cooling System for Microelectronics Cooling

A honeycomb porous microchannel cooling system for electronics cooling was proposed in this article. The design, fabrication, and test system configuration of the microchannel heat sink were summarized. Preliminary experimental investigation was conducted to understand the characteristics of heat transfer and cooling performance under steady single-phase flow. In the experiments, a brass microchannel heat sink was attached to a test heater with 8 cm2 area. The experimental results show that the cooling system is able to remove 18.2 W/cm2 of heat flux under 2.4 W pumping power, while the junction wall temperature is 48.3°C at the room temperature of 26°C. Extensive experiments in various operation conditions and parameters for the present cooling system were also conducted. The experimental results show that the present cooling system is able to perform heat dissipation well.

Cooling Behavior in a Novel Heat Sink Based on Multilayer Staggered Honeycomb Structure

A novel heatsink based on a multilayer stack of thin metal plates with staggered honeycomb cells microchannels was investigated in this paper. A series of working-parametric tests such as different heat sink pipe diameter and pumping power were conducted for the microchannel cooling system to determine the heat transfer performance under small flow rate conditions. For the double fluid flow inlets and outlets heatsink design, experimental results showed that more uniform substrate temperature distribution was obtained than the single inlet and outlet ones. It showed that the heatsink design provided a good choice for electronic chips cooling applications.Copyright

A Honeycomb Micro Channel Cooling System for Electronics Cooling

A honeycomb porous micro channel cooling system for cooling of electronic chips is proposed in this paper. The design, fabrication, test system configuration of the micro channel heat sink is summarized. Preliminary experimental investigation is conducted to determine the heat transfer characteristics and cooling performance under steady single-phase flow of water liquid. In the experiments, the brass micro channel heat sink is attached to a test heater with 8cm2 area, the experimental results show that the cooling system can effectively remove the heat flux of 18.2W/cm2 under 2.4W pumping power, while the junction-wall temperature is 48.3°C at the room temperature of 26°C. The experimental results show that the present cooling system has good performance.Copyright

Thermal Performance of the Multilayered Honeycomb Microchannel Heat Sink

To develop a high effectiveness, reliable, cost-effective compact heat exchanger is one of the key issues for effective use of thermal energy. By stacking multilayered flat thin rectangular plates with a number of regular honeycomb cells etched inside, the well designed staggered fluid flow channels are formed to enhance heat transfer. For the cooling system with the new type design heat sink, experimental investigations were conducted under different flow rates and input heating powers. The heat power density of 15.7W/cm2 can effectively removed with a substrate temperature rise of 61.9¿ under 2.4W pump power. The results show that the heat sink design provides a good choice for electronic products cooling applications.

Experimental Study on a Honeycomb Micro Channel Cooling System

A honeycomb porous micro channel cooling system for cooling of electronic chips was proposed. Experimental investigation was conducted to determine the heat transfer characteristics and cooling performance of this micro channel cooling system. The heat transfer capabilities of the cooling system with different pipe diameters, different working media and various pumping power were evaluated. The influences of working flow rate and test system on the cooling performance were also analyzed experimentally. The results showed that the better cooling capability of the system not only relied on the increasing pump power, but also the agreement between pumps diameters and system pipes diameters. The thermo-physical characters and mass flow rate of the working fluid were also important to the system performance.Copyright