Xiaolu Song

30km Downstream Transmission Using 4×25Gb/s 4-PAM Modulation with Commercial 10Gbps TOSA and ROSA for 100Gb/s-PON

We proposed a novel 100Gb/s PON scheme using 4-PAM modulation with commercial low-cost 10Gbps TOSA/ROSA compatible with 40Gb/s TWDM-PON. Experimental results show that with EQ compensating bandwidth limitation and CD, 30km transmission is available.

A Low-Cost 100GE Optical Transceiver Module for 2km SMF Interconnect with PAM4 Modulation

With the introduction of PAM4 modulation, a novel 100GE optical transceiver module has been proposed using the low-cost 4×10Gbps DML TOSA and PIN ROSA. 4×25Gbps PAM4 signal transmission has been demonstrated over 2km SMF on-line with -11dBm sensitivity and 4dB link margin.

A low-cost 4×25Gbps PAM4 module for short-reach optical interconnection

A low-cost 4×25Gbps PAM4 module for short-reach optical interconnection has been proposed using the commercial low-cost 10Gbps DML TOSA and PIN ROSA. This scheme has been demonstrated over 2km SMF and can also be used for MMF interconnection.

84-Channel ultra-dense silicon photonics optical IO

An ultra-dense optical IO solution for silicon photonic chip is proposed, based on multi-core fiber array and three dimensional optical interposer. We demonstrate an 84-channel prototype with 3.5mm width on optical coupling interface.

PAM4 transmission for short reach optical interconnection

PAM4 is a promising solution for the high speed optical interconnection, it aligns well with the trend of modulation technologies and allows using lower cost optical components. This paper summarizes the experimental demonstration of PAM4 under different speed for the next generation 100GE, 400GE and beyond with the introduction of PAM4, lessons learned from industry standards and the perspective on the tendency will be presented.

Improving the efficiency of fibre-chip grating couplers near 1310 nm

We present our recent work on fibre-chip grating couplers operating around 1310 nm. For the first time, we demonstrated the combination of dual-etch and apodization design approaches which can offer state of the art performance. Initial tests from fabricated structures show a -2.2dB loss.

Ultra-dense silicon photonics optical IO solution for optical chip scale package

Optical chip scale package is a key transceiver technology for future communication networks. A novel scheme is proposed with 336 electrical and optical channels integrated on single substrate. A novel ultra-dense optical IO solution for silicon photonics chips is proposed as an important enabling technology.

Ultra-dense, low-loss, universal optical coupling solution for optical chip scale package

We propose an novel ultra-dense, low-loss optical coupling solution with optimized coupler design for silicon photonics chip, which is a key enabling technology for optical chip scale package with 336 channels.

High Density Silicon Photonic Integrated Transceiver Chip with 1.2 Tbps Capacity

To achieve high capacity, high density, low power consumption and low-cost non-hermetic package, a silicon photonic transceiver chip with 42-channel I/O was demonstrated. With each I/O supports 28 Gbps rate, the transceiver chip reached 1.2 Tbps capacity.