Xinkun Zhu

Bauschinger Effect and Back Stress in Gradient Cu-Ge Alloy

Using surface mechanical attrition treatment (SMAT), a gradient structure composed of two gradient structure (GS) layers and a coarse grain (CG) layer was generated from a Cu-5.7xa0wt pct Ge alloy, significantly improving the yield strength of the sample. Unloading–reloading tests showed an unusual Bauschinger effect in these GS samples. The back stresses caused by the accumulated geometrically necessary dislocations (GNDs) on the GS/CG border increased with increasing strain. As found by electron backscatter diffraction (EBSD), the GNDs are mainly distributed in the gradient structured layer, and the density of the GNDs increase with increasing SMAT time. The effect of the back stress increased with increasing SMAT processing time due to the increase in the strain gradient. The pronounced Bauschinger effect in a GS sample can improve the resistance to forward plastic flow and finally contributes to the high strength of GS samples.

Ultrahigh Strength Copper Obtained by Surface Mechanical Attrition Treatment at Cryogenic Temperature

The purpose of this paper is to investigate the effect of dynamic recovery on the mechanical properties of copper (Cu) during surface mechanical attrition treatment (SMAT) at both room temperature (RT) and cryogenic temperature (CT). Copper sheets were processed by SMAT at RT and at CT for 5, 15, and 30xa0min, respectively. The Cu samples after SMAT at RT for 30xa0min exhibited better ductility but lower strength than the samples after SMAT at CT for 30xa0min due to dynamic recovery. X-ray diffraction analysis indicated that decreasing temperature during SMAT led to an increase in the twin and dislocation densities. In addition, a thicker gradient structure layer with finer grains was obtained in the SMAT-processed Cu samples at CT than at RT. The results indicated that SMAT at CT can effectively suppress the occurring of dynamic recovery and produce ultrahigh strength pure copper without seriously sacrificing its ductility.