Xiong Chuanbing

Different properties of GaN-based LED grown on Si(111) and transferred onto new substrate

InGaN MQW LEDs, grown by metal-organic chemical vapor deposition (MOCVD) on Si(111) substrates, were successfully bonded and transferred onto new Si substrate. After chemical etching Si(111) substrate and inductively coupled plasma (ICP) etching the transferred LED film to Si-doped layer, a vertical structure GaN blue LEDs were then fabricated. The characteristics of the lateral structure LED (grown on Si) and the vertical structure LED (bonded on Si) were investigated. It shows the performance of vertical structure LEDs had obviously been improved compared to the lateral structure LEDs and the tensile stress in GaN layer of vertical structure LEDs is smaller than that in lateral structure LEDs.

High optical efficiency GaN based blue LED on silicon substrate

After nearly ten years of exploration, our team firstly had a breakthrough in the technologies of materials growth and thin film chip manufacturing for high efficiency GaN based blue LED on silicon substrate in the world. The internal quantum efficiency and extraction efficiency of the vertical structure blue LED chips reached 80%. These LED chips have been realized mass production, and been successfully used in street lamps, miners lamp, down light, bulb light, flashlight and display imaging etc. In this paper, the related key technologies are comprehensive and systematically introduced. Selective-Area-Growth and Maskless-Micro-Epitaxial-Lateral-Overgrowth technologies were invented, by which a high crystalline quality GaN film was achieved with an only 100 nm AlN buffer layer. A set of systemic technologies were invented for manufacturing vertical thin film structure LED on silicon substrate, included high reflectance low resistance P type ohmic contact electrode, high stability low resistance N type electrode ohmic contact, surface roughening, complementary electrode, releasing residual tensile stress of GaN film technologies etc. At 350 mA (35 A/cm2), the light output power of blue LED (450 nm) on silicon is 657 mW, and external quantum efficiency of it is 68.1%.

Stress Distribution in GaN Films grown on Patterned Si (111) Substrates and Its Effect on LED Performance

Crack free GaN films were grown on 1200×1200μm2 patterned Si (111) substrates and 36 light emitting diodes (LEDs) were fabricated in each pattern unit. Spatial distribution of the tensile stress in the pattern units and its influence on the LED performance are studied by micro-Raman and electroluminescence (EL). The Raman shift of the GaN E2 mode shows that the tensile stress is the maximum at the center, partially relaxed at the edge, and further relaxed at the corner. With the stress relaxation, the EL wavelength has a significant blue shift and the luminous intensity shows a great enhancement.