Xitao Wang
University of Science and Technology of China
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Publication
Featured researches published by Xitao Wang.
IEEE Transactions on Advanced Packaging | 2000
Ying Fu; Yanli Wang; Xitao Wang; Johan Liu; Zonghe Lai; Guoliang Chen; M. Willander
Electrical conduction through anisotropically conductive adhesive (ACA) is caused by deformation of metal fillers under pressure and heat. In this work, the hardness of the electrical particles under various deformation degrees was determined by nano-indentor measurements and the electrical resistance of the electrical contacts was measured under various deformation degrees. Theoretical model and simulation have been developed for the microscopic mechanism of the electrical conduction through metal fillers in the anisotropically conductive adhesive. By comparing with experimental data it is concluded that the deformation of the metal filler in our ACA is plastic even at rather low external load. Further theoretical simulation reveals two important aspects of the conductance characteristics. The conductance is improved by increasing the external load but the dependence of the conductance on the spatial position of the metal filler becomes stronger. Design and optimization of the ACA with respect to the absolute value of the electric conductance and its dependence on the spatial position of the metal filler are of essential importance for the electronics packaging application of the anisotropically conductive adhesives.
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A | 1997
Xitao Wang; Yanli Wang; Guoliang Chen; Johan Liu; Zonghe Lai
The characteristics of conductive particles in anisotropically conductive adhesives (ACA) were studied by optical microscopy observation and nano indenter measurements. The indentation measurement was performed at the particles in ACA joints using different bonding forces. The load-displacement curves and microhardness values are obtained, which indicate that the nano indenter could be used for quantitative estimation of the electrical and mechanical characteristics of conductive particles in ACAs.
IEEE CPMT transactions, Part B: Advanced Packaging | 2000
Ying Fu; Yanli Wang; Xitao Wang; Johan Liu; Zonghe Lai; Guoliang Chen; Magnus Willander
EurosimE/2001 | 2001
Jiemin Zhou; Xitao Wang; Liu Chen; Johan Liu
ECTC´02 | 2002
Johan Liu; James E. Morris; Xitao Wang; Liqiang Cao
The Fourth International Symposium on Electronic Packaging Technology | 2001
Cristina Andersson; Xitao Wang; Zonghe Lai; Johan Liu
Proceedings of the IMAPS Nordic | 2001
Cristina Andersson; Xitao Wang; Zonghe Lai; Johan Liu
Proceedings of The IMAPS Nordic 38th Annual Conference | 2001
Xitao Wang; Liu Chen; Zonghe Lai; Johan Liu
ECTC 51th | 2001
Johan Liu; Xitao Wang; James E. Morris
Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis | 2000
Xitao Wang; Cristina Andersson; Zonghe Lai; Johan Liu