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Dive into the research topics where Xitao Wang is active.

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Featured researches published by Xitao Wang.


IEEE Transactions on Advanced Packaging | 2000

Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesive

Ying Fu; Yanli Wang; Xitao Wang; Johan Liu; Zonghe Lai; Guoliang Chen; M. Willander

Electrical conduction through anisotropically conductive adhesive (ACA) is caused by deformation of metal fillers under pressure and heat. In this work, the hardness of the electrical particles under various deformation degrees was determined by nano-indentor measurements and the electrical resistance of the electrical contacts was measured under various deformation degrees. Theoretical model and simulation have been developed for the microscopic mechanism of the electrical conduction through metal fillers in the anisotropically conductive adhesive. By comparing with experimental data it is concluded that the deformation of the metal filler in our ACA is plastic even at rather low external load. Further theoretical simulation reveals two important aspects of the conductance characteristics. The conductance is improved by increasing the external load but the dependence of the conductance on the spatial position of the metal filler becomes stronger. Design and optimization of the ACA with respect to the absolute value of the electric conductance and its dependence on the spatial position of the metal filler are of essential importance for the electronics packaging application of the anisotropically conductive adhesives.


IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A | 1997

Quantitative estimate of the characteristics of conductive particles in ACA by using nano indenter

Xitao Wang; Yanli Wang; Guoliang Chen; Johan Liu; Zonghe Lai

The characteristics of conductive particles in anisotropically conductive adhesives (ACA) were studied by optical microscopy observation and nano indenter measurements. The indentation measurement was performed at the particles in ACA joints using different bonding forces. The load-displacement curves and microhardness values are obtained, which indicate that the nano indenter could be used for quantitative estimation of the electrical and mechanical characteristics of conductive particles in ACAs.


IEEE CPMT transactions, Part B: Advanced Packaging | 2000

Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesives

Ying Fu; Yanli Wang; Xitao Wang; Johan Liu; Zonghe Lai; Guoliang Chen; Magnus Willander


EurosimE/2001 | 2001

Modelling of Heat Transfer for System in Package (SIP)

Jiemin Zhou; Xitao Wang; Liu Chen; Johan Liu


ECTC´02 | 2002

Web Course on Electrically Conductive Adhesives

Johan Liu; James E. Morris; Xitao Wang; Liqiang Cao


The Fourth International Symposium on Electronic Packaging Technology | 2001

Low Cycle fatigue of lead-free solders

Cristina Andersson; Xitao Wang; Zonghe Lai; Johan Liu


Proceedings of the IMAPS Nordic | 2001

Low-Cycle fatigue life of SnAgBi and Sn-Ag lead-free solders

Cristina Andersson; Xitao Wang; Zonghe Lai; Johan Liu


Proceedings of The IMAPS Nordic 38th Annual Conference | 2001

Comparison of Mechanical Fatigue Test and Thermal Cycling for Failure Analysis of Solder Joints

Xitao Wang; Liu Chen; Zonghe Lai; Johan Liu


ECTC 51th | 2001

Development of an internet Course on Conductive Adhesives for Electronics Packaging

Johan Liu; Xitao Wang; James E. Morris


Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis | 2000

Fatigue properties of lead-free solders

Xitao Wang; Cristina Andersson; Zonghe Lai; Johan Liu

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Johan Liu

Chalmers University of Technology

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Zonghe Lai

Chalmers University of Technology

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Cristina Andersson

Chalmers University of Technology

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Liu Chen

Chalmers University of Technology

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Ying Fu

Royal Institute of Technology

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James E. Morris

Portland State University

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Liqiang Cao

Chalmers University of Technology

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M. Willander

Chalmers University of Technology

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