Xiurong Zhu

Comparative study on constitutive models to predict flow stress of Fe-Cr-Ni preform reinforced Al-Si-Cu-Ni-Mg composite

The isothermal compression tests were carried out on Gleeble-3500 thermal-mechanical simulation machine in a temperature range of 298-473 K and strain rate range of 0.001-10 s-1. The experimental results show that the flow stress data are negatively correlated with temperature for temperature softening, and the strain rates sensitivity of this composite increases with elevating temperature. Based on the experimental data, Johnson-Cook, modified Johnson-Cook and Arrhenius constitutive models were established. The accuracy of these three constitutive models was analyzed and compared. The results show that the values predicted by Johnson-Cook model could not agree well with the experimental values. The prediction accuracy of Arrhenius model is higher than that of Johnson-Cook model but lower than that of the Modified Johnson-Cook model.

Generation mechanism of interfacial layer and its effect on Fe-Cr-Ni/Al-Si-Cu-Ni-Mg composite performance

Fe-Cr-Ni/Al-Si-Cu-Ni-Mg composite was taken as the experimental material. The chemical composition of interfacial layer was tested. The generation mechanism and influence of interfacial layer on the composite were analyzed. The results indicated that the generation of interfacial layer is sensitive to temperature. Interfacial layer will generate rapidly when temperature reaches 500 °C or above. The interfacial layer is mainly composed of Al, Si, Cu, Fe, and Cr, element Ni distributes at the outward of the interfacial layer for the precipitate of Ni later than Si and Cu, and there is almost no diffusion of Ni during the solution treatment. During heat treatment process, unequal quantity changing of metal atom results in disperse or concentrated vacancies or holes near the matrix. The existence of interfacial layer will induce a decrease of compression strength and plasticity at room temperature and an increase of strength at higher temperature comparing with composite without interfacial layer.