Y.-C. Weng

Technological Development of Advanced Asymmetric Magnetic Soft Mold Micro-Imprint Lithography

This study proposed an advanced micro-imprint lithography (MIL), which integrates electromagnetic field-aided hot embossing and PDMS asymmetric magnetic flexible soft mold imprinting techniques, to imprint and replicate the microlens array structure. It is similar to the continuous grayscale technique; however, it is smoother than the structural form defined by the semi-conductor grayscale mask technique, and the process is simpler with lower costs, making it a good alternative for imprinting techniques and applications. This study also employed prescale films to measure and discuss the distribution of imprinting force on asymmetric magnetic soft molds. The results indicated that the magnetic soft mold and the substrate surface can be fully contacted. Since the magnetic powder reveals a skewed distribution, the test results of prescale film indicated that color depth is related to the concavo-convex of magnetic powder. Thus, the depth and accuracy of structural molding can be controlled in advance by casting the inclining platform. Finally, the SEM observation showed that if an inclining platform is used for composite magnetic PDMS casting, the microlens array asymmetric magnetic soft mold structure, which is complementary to it, could be obtained. The asymmetric magnetic soft mold was applied together with electromagnetic field-aided hot embossing equipment to imprint and replicate different continuous and smooth microlens array structures with foreseeable depth.

Application of Vacuum-Assisted Filling System with Ultraviolet-Light-Emitting Diode Array to Fabrication of Waveguide Microstructures

In this study, we proposed a novel technology for developing a nanoscale, high-resolution, and cost-efficient next-generation semiconductor process that uses exposure technology with ultraviolet-light-emitting diode (UV-LED) arrays and poly(dimethylsiloxane) (PDMS) flexible soft mold imprint technology in order to develop a vacuum-assisted photoresist filling technology for microstructures. By integrating the characteristics of the PDMS soft mold, photocure resist, and vacuum-assisted filling system to fabricate waveguide components, conformal contact was obtained between a PDMS soft mold and a substrate surface, at a low surface free energy. The vacuum-assisted filling system was used to achieve compact and complete photoresist filling. There is no residual layer left after filling and a subsequent process is no longer necessary; thus, cost and process time can be effectively reduced. Recently, nanometer component manufacturing technology and its applications have become more sophisticated.

Electromagnetic Imprint Technique Combined with Electrophoretic Deposition Technique in Forming Microelectrode Structures

In this study, we integrate the electromagnetic soft mold imprint technique with the electrophoretic deposition technique, and apply them to forming microelectrode structures. The compound casting technology is used to produce a magnetic soft mold of a microelectrode structure, which can effectively reduce the time and cost of molding. The use of an electromagnetic imprint device can apply more evenly distributed imprint pressure, thus, the microelectrode structure can be entirely imprinted onto an indium tin oxide (ITO) soft substrate, and then the electrophoretic deposition technique is employed to deposit titanium dioxide (TiO2) nanopowder on the ITO soft substrate of the microelectrode structure. In addition to the key techniques and processes of electromagnetic soft mold imprinting, In this study, we explore the application of electrophoretic deposition and imprinting to prove that combining these techniques to form a microelectrode structure is a simple, low-cost, high duplication, and high-speed process. It is proven a good choice for producing micro-nanocomponents.

A Study on Application of Making Porous Micro-Structural Aluminum Oxide Template by Anodic Aluminum Oxide Processing Technology in Cell Reproduction

This study employed the Anodic Aluminum Oxide (AAO) method twice for AAO processing to prepare neatly-arranged aluminum oxide film micro nano porous structure, and conducted experiments by adjusting different condition parameters (current, voltage, and temperature). The experimental results showed that voltage would directly affect the pore space and surface roughness of the aluminum oxide film. In addition, after anodic treatment, the positive and negative surfaces demonstrated varying degrees of roughness under the same conditions. In this study, the experiment of surface roughness impact on cell proliferation demonstrated that cell proliferation was better when surface roughness was in the range of 0.4 nm < Ra < 1.2 nm.

Deformation Mode Construction Using Photoresist Microstructure Devices Produced with Nanoindention Technology

In this study, we try to produce SU-8 photoresist microstructure devices using nano-imprint technology, and try to conduct nano-indention tests on SU-8 photoresist with nano-indention detector, in order to describe the behaviors and characteristics of nano-indentions on SU-8 microstructure devices and establish the deformation mode for the indention under nano-meter level. The tests tell us that, after nano-indention tests, the result indention hardness increases with the loading rate, indention repeats, and reduction of load or depth. Similarly, the indention hardness decreases because of reduction of loading rate, extension of loading time, and increase of load, and depth. Finally, we propose a deformation mode for nano-indention. This mode can also be used to explain the deformation behavior of SU-8 under nano-indention.

Effects of Electrolyte Formulas on Electrochemical Polish Planarization of Pure Copper

Electrochemical polish technology could enhance the chemo-mechanical polishing efficiency of copper material. During the electrochemical polishing process, both the components and operation parameters of electrochemical polish solution are the key factors influencing planarization ability. This work measured the surface topography and roughness of copper material after mechanical polish by an atomic force microscope (AFM), and added glycerol in different ratios to the phosphoric acid (85 wt %), which was the main composition of experiment solution. Electrochemical polish was conducted within the potential action range in passivation area, and the surface topography and roughness of copper material after electrochemical polish was measured by AFM. The difference in surface topography of copper material after electrochemical polish was compared as well.The experiment indicated that after electrochemical polish in pure phosphoric acid for 50 sec, the surface roughness of copper material obviously decreased from 6.921nm (Ra) to 0.820nm (Ra), and the planarization was more obvious with the increase of electrochemical polish time. The above results could appear in different electrolyte formulas, indicating that electrochemical polish was a good processing method for copper material planarization. This work also proposed the effect of analyzing the electrochemical polish time on planarization through planarization efficiency. Based on the analysis, the planarization efficiency was decreased with the increase of electrochemical polish time, which indicated that longer electrochemical polish time did not yield better result. This work also found that the surface is not only flattened, but also glossed after electrochemical polish.

12-in. wafer imprinting using soft mold and gas pressure mechanism

In this paper, a new concept and mechanism has been developed, the PDMS mold is used and the gas pressure mechanism is employed for 12411. wafer nanoimprint. As illustrated in Fig. 1, the gas pressurized imprinting process consists of four steps: (1) placing the substrate with resist onto the stamper of chamber B, which is then placed above a heatingkooling plate; (2) enclosing the chamber B and vacuuming, and then heating the substrateimold stacker; (3) blowing the gas into the chamber A to exert gas pressure uniformly over the substrate, forcing it into the mold and imprinting resist; (4) eihausting the chamber A gas and blowing the chamber B gas, and then opening the chamber A to get the substrate with patterns.